SLPS414B December 2013 – May 2017 CSD19532Q5B
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
DIM | MILLIMETERS | ||
---|---|---|---|
MIN | NOM | MAX | |
A | 0.80 | 1.00 | 1.05 |
b | 0.36 | 0.41 | 0.46 |
c | 0.15 | 0.20 | 0.25 |
c1 | 0.15 | 0.20 | 0.25 |
c2 | 0.20 | 0.25 | 0.30 |
D1 | 4.90 | 5.00 | 5.10 |
D2 | 4.12 | 4.22 | 4.32 |
D3 | 3.90 | 4.00 | 4.10 |
d | 0.20 | 0.25 | 0.30 |
d1 | 0.085 TYP | ||
d2 | 0.319 | 0.369 | 0.419 |
E | 4.90 | 5.00 | 5.10 |
E1 | 5.90 | 6.00 | 6.10 |
E2 | 3.48 | 3.58 | 3.68 |
e | 1.27 TYP | ||
H | 0.36 | 0.46 | 0.56 |
L | 0.46 | 0.56 | 0.66 |
L1 | 0.57 | 0.67 | 0.77 |
θ | 0° | — | — |
K | 1.40 TYP |
For recommended circuit layout for PCB designs, see application note SLPA005 – Reducing Ringing Through PCB Layout Techniques.
Notes: