SLPS453E May   2014  – January 2022 CSD23382F4

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Trademarks
    2. 6.2 Electrostatic Discharge Caution
    3. 6.3 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Mechanical Dimensions
    2. 7.2 Recommended Minimum PCB Layout
    3. 7.3 Recommended Stencil Pattern
    4. 7.4 CSD23382F4 Embossed Carrier Tape Dimensions

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YJC|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision D (October 2021) to Revision E (January 2022)

  • Changed maximum height from "0.35-mm" to "0.36-mm" in Features sectionGo
  • Changed maximum height from "0.35-mm" to "0.36-mm" in Typical Device Dimensions Go
  • Changed maximum height from "0.35-mm" to "0.36-mm" in Mechanical Dimensions sectionGo

Changes from Revision C (October 2014) to Revision D (October 2021)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added footnote with link to support documentGo

Changes from Revision B (July 2014) to Revision C (October 2014)

  • Corrected timing VDS to read –6 V Go