SLPS284D August   2011  – December 2016 CSD87330Q3D

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Power Block Performance
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Power Block Device Characteristics
    7. 5.7 Typical Power Block MOSFET Characteristics
  6. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Equivalent System Performance
      2. 6.1.2 Power Loss Curves
      3. 6.1.3 Safe Operating Area (SOA) Curves
      4. 6.1.4 Normalized Curves
    2. 6.2 Typical Application
      1. 6.2.1 Design Example: Calculating Power Loss and SOA
      2. 6.2.2 Operating Conditions
        1. 6.2.2.1 Calculating Power Loss
        2. 6.2.2.2 Calculating SOA Adjustments
  7. 7Layout
    1. 7.1 Layout Guidelines
      1. 7.1.1 Electrical Performance
      2. 7.1.2 Thermal Performance
    2. 7.2 Layout Example
  8. 8Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Community Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Q3D Package Dimensions
    2. 9.2 Land Pattern Recommendation
    3. 9.3 Stencil Recommendation
    4. 9.4 Q3D Tape and Reel Information
    5. 9.5 Pin Configuration

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DPB|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (April 2013) to D Revision

  • Added small reel optionGo
  • Added footnote for pulsed current ratingGo
  • Changed Recommended PCB Design Overview section to Layout sectionGo
  • Added Device and Documentation Support sectionGo
  • Changed MECHANICAL DATA section to Mechanical, Packaging, and Orderable Information sectionGo

Changes from B Revision (September 2011) to C Revision

  • Changed the Q3D Package Dimensions sectionGo

Changes from A Revision (September 2011) to B Revision

  • Change Sync FET UIS to 157 mJ.Go
  • Change Control FET Rg Typ/Max to 1.5/3 Go
  • Change HS RDS(ON)Typ/Max to 9.4/11.3. Go
  • Change LS RDS(ON)Typ/Max to 4.7/5.7. Go

Changes from * Revision (August 2011) to A Revision

  • Remove ZDS(on) Max values Go
  • Remove ZDS(on) Max values. Go
  • Add Electrical Performance bulletGo
  • Changed DIM A Max DimensionsGo