SLPS560 December   2015 CSD87502Q2

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Community Resources
    2. 6.2 Trademarks
    3. 6.3 Electrostatic Discharge Caution
    4. 6.4 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Package Dimensions
    2. 7.2 PCB Land Pattern
    3. 7.3 Recommended Stencil Opening
    4. 7.4 Q2 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DLV|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

7.1 Package Dimensions

CSD87502Q2 Mechanical_Drawing.png

All dimensions are in mm, unless otherwise stated.

7.2 PCB Land Pattern

CSD87502Q2 PCB_Land_Pattern.png

For recommended circuit layout for PCB designs, see application note SLPA005 – Reducing Ringing Through PCB Layout Techniques.

7.3 Recommended Stencil Opening

CSD87502Q2 Recommended_Stencil.png

All dimensions are in mm, unless otherwise stated.

7.4 Q2 Tape and Reel Information

CSD87502Q2 M0168-01_LPS235.gif

NOTES:

1. Measured from centerline of sprocket hole to centerline of pocket
2. Cumulative tolerance of 10 sprocket holes is ±0.20
3. Other material available
4. Typical SR of form tape Max 109 OHM/SQ
5. All dimensions are in mm, unless otherwise specified.