SLPS456A February   2014  – December 2023 CSD88539ND

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Specifications
    1. 4.1 Electrical Characteristics
    2. 4.2 Thermal Information
    3. 4.3 Typical MOSFET Characteristics
  6. 5Device and Documentation Support
    1. 5.1 Trademarks
    2. 5.2 Electrostatic Discharge Caution
  7. 6Revision History
  8. 7Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.2 Thermal Information

(TA = 25°C unless otherwise stated)
THERMAL METRICMINTYPMAXUNIT
RθJLJunction-to-Lead Thermal Resistance(1)20°C/W
RθJAJunction-to-Ambient Thermal Resistance(1)(2)75
(1) RθJC is determined with the device mounted on a 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81-cm × 3.81-cm), 0.06-inch (1.52-mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu.