SLPS598E May 2017 – June 2024 CSD88584Q5DC
PRODUCTION DATA
THERMAL METRIC | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|
RθJA | Junction-to-ambient thermal resistance (min Cu)(2) | 125 | °C/W | ||
Junction-to-ambient thermal resistance (max Cu)(2)(1) | 50 | ||||
RθJC | Junction-to-case thermal resistance (top of package)(2) | 2.1 | °C/W | ||
Junction-to-case thermal resistance (VIN pin)(2) | 1.1 |