SLPS597D April 2017 – June 2024 CSD88599Q5DC
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
The SOA curve in Figure 4-3 provides guidance on the temperature boundaries within an operating system by incorporating the thermal resistance and system power loss. This curve outlines the board and case temperatures required for a given load current. The area under the curve dictates the safe operating area. This curve is based on measurements made on a PCB design with dimensions of 4in (W) × 3.5in (L) × 0.062in (H) and 6 copper layers of 2oz copper thickness.