SLPS597D April   2017  – June 2024 CSD88599Q5DC

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Recommended Operating Conditions
    3. 4.3 Power Block Performance
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Typical Power Block Device Characteristics
    7. 4.7 Typical Power Block MOSFET Characteristics
  6. 5Application and Implementation
    1. 5.1 Application Information
    2. 5.2 Brushless DC Motor With Trapezoidal Control
    3. 5.3 Power Loss Curves
    4. 5.4 Safe Operating Area (SOA) Curve
    5. 5.5 Normalized Power Loss Curves
    6. 5.6 Design Example – Regulate Current to Maintain Safe Operation
    7. 5.7 Design Example – Regulate Board and Case Temperature to Maintain Safe Operation
    8. 5.8 Layout
      1. 5.8.1 Layout Guidelines
        1. 5.8.1.1 Electrical Performance
        2. 5.8.1.2 Thermal Considerations
      2. 5.8.2 Layout Example
  7. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Support Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  8. 7Revision History
  9. 8Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DMM|22
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Trademarks

NexFET and DualCool™ are trademarks of TI.

TI E2E™ is a trademark of Texas Instruments.

All trademarks are the property of their respective owners.