SLPS723 September   2020 CSD95410RRB

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Device and Documentation Support
    1. 5.1 Device Support
      1. 5.1.1 Third-Party Products Disclaimer
    2. 5.2 Documentation Support
    3. 5.3 Receiving Notification of Documentation Updates
    4. 5.4 Support Resources
    5. 5.5 Trademarks
    6. 5.6 Electrostatic Discharge Caution
    7. 5.7 Glossary
  6. 6Mechanical, Packaging, and Orderable Information
    1. 6.1 Mechanical Drawing
    2. 6.2 Recommended PCB Land Pattern
    3. 6.3 Recommended Stencil Opening
    4. 6.4 Alternate Industry Standard Compatible PCB Land Pattern
    5. 6.5 Alternate Industry Standard Compatible Stencil Opening
    6. 6.6 Package Option Addendum

Package Options

Mechanical Data (Package|Pins)
  • RRB|41
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Mechanical Drawing

GUID-CD1121BF-4664-4D97-BFEC-8E628A366621-low.png
  1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
  2. This drawing is subject to change without notice.
  3. The package thermal pads must be soldered to the printed circuit board for optimal thermal and mechanical performance.