SLPS723 September   2020 CSD95410RRB

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Device and Documentation Support
    1. 5.1 Device Support
      1. 5.1.1 Third-Party Products Disclaimer
    2. 5.2 Documentation Support
    3. 5.3 Receiving Notification of Documentation Updates
    4. 5.4 Support Resources
    5. 5.5 Trademarks
    6. 5.6 Electrostatic Discharge Caution
    7. 5.7 Glossary
  6. 6Mechanical, Packaging, and Orderable Information
    1. 6.1 Mechanical Drawing
    2. 6.2 Recommended PCB Land Pattern
    3. 6.3 Recommended Stencil Opening
    4. 6.4 Alternate Industry Standard Compatible PCB Land Pattern
    5. 6.5 Alternate Industry Standard Compatible Stencil Opening
    6. 6.6 Package Option Addendum

Package Options

Mechanical Data (Package|Pins)
  • RRB|41
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.