SLPS759 January   2023

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Device and Documentation Support
    1. 5.1 Documentation Support
      1. 5.1.1 Related Documentation
    2. 5.2 Receiving Notification of Documentation Updates
    3. 5.3 Support Resources
    4. 5.4 Trademarks
    5. 5.5 Electrostatic Discharge Caution
    6. 5.6 Glossary
  6. 6Mechanical, Packaging, and Orderable Information
    1. 6.1 Package Option Addendum
    2. 6.2 Tape and Reel Information
    3. 6.3 Mechanical Drawing
    4. 6.4 Recommended PCB Land Pattern
    5. 6.5 Recommended Stencil Opening
    6. 6.6 Alternate Industry Standard Compatible PCB Land Pattern
    7. 6.7 Alternate Industry Standard Compatible Stencil Opening

Package Options

Mechanical Data (Package|Pins)
  • RRB|41
Thermal pad, mechanical data (Package|Pins)

1 Features

  • Active current balancing between paralleled phases sharing a single PWM input
  • Peak continuous current: 90-A
  • System efficiency: > 95% at 30-A
  • High-frequency operation: 1.25-MHz
  • Diode emulation function to enable efficiency discontinuous conduction mode (DCM) operation
  • Temperature compensated bi-directional current sense
  • Analog temperature output
  • Fault monitoring
  • PWM signal compatible: 3.3 V and 5 V
  • Tri-state PWM input
  • Integrated bootstrap switch
  • Optimized dead-time for shoot-through protection
  • High-density industry common QFN 5-mm x 6-mm footprint
  • Ultra-low inductance package
  • System-optimized PCB footprint
  • Thermally enhanced topside cooling
  • RoHS compliant - lead-free terminal plating
  • Halogen free