CSD95430RRB Synchronous Buck NexFET™ Smart Power Stage

1 Features

Active current balancing between paralleled phases sharing a single PWM input
Peak continuous current: 90-A
System efficiency: > 95% at 30-A
High-frequency operation: 1.25-MHz
Diode emulation function to enable efficiency discontinuous conduction mode (DCM) operation
Temperature compensated bi-directional current sense
Analog temperature output
Fault monitoring
PWM signal compatible: 3.3 V and 5 V
Tri-state PWM input
Integrated bootstrap switch
Optimized dead-time for shoot-through protection
High-density industry common QFN 5-mm x 6-mm footprint
Ultra-low inductance package
System-optimized PCB footprint
Thermally enhanced topside cooling
RoHS compliant - lead-free terminal plating
Halogen free

2 Applications

Multiphase synchronous buck converters
- Greater than 500-A
- High-frequency
Memory and graphic cards
Data center and network switches
Campus and branch switches
Core and edge routers
Hardware accelerator cards
High-performance CPU/ASIC/FPGA power

3 Description

The CSD95430RRBNexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design. This power stage features an active current balance feature which allows multiple power stages to be paralleled off a single PWM input. This enables phase multiplication for very high current applications without the need for a similarly high phase count controller. The active current balance ensures that the multiplied phases share current evenly so no significant derating of current capability is needed when paralleling phases.

Device Information

PART NUMBER	PACKAGE⁽¹⁾	BODY SIZE (NOM)
CSD95430RRB	VQFN-CLIP	5.00 mm x 6.00 mm

(1) For all available packages, see the orderable addendum at the end of the data sheet.