SLPS671A June   2017  – January 2018 CSD95495QVM

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
    1.     Typical Power Stage Efficiency and Power Loss
  4. 4Revision History
  5. 5Pin Configuration and Functions
    1.     Pin Functions
  6. 6Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
  7. 7Application Schematic
  8. 8Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Community Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1 Mechanical Drawing
    2. 9.2 Recommended PCB Land Pattern
    3. 9.3 Recommended Stencil Opening

Package Options

Mechanical Data (Package|Pins)
  • DMH|18
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2 Recommended PCB Land Pattern

CSD95495QVM PCB1.png
CSD95495QVM PCB2.png
  1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
  2. This drawing is subject to change without notice.
  3. This package is designed to be soldered to a thermal pad on the board. For more information, see QFN/SON PCB Attachment (SLUA271).