SLPS760 January   2023 CSD96416

PRODUCTION DATA  

  1. 1Feature
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Device and Documentation Support
    1. 5.1 Receiving Notification of Documentation Updates
    2. 5.2 Support Resources
    3. 5.3 Trademarks
    4. 5.4 Electrostatic Discharge Caution
    5. 5.5 Glossary
  6. 6Mechanical, Packaging, and Orderable Information
    1. 6.1 Package Option Addendum
    2. 6.2 Tape and Reel Information
    3. 6.3 Mechanical Drawing
    4. 6.4 Recommended PCB Land Pattern
    5. 6.5 Recommended Stencil Opening

Package Options

Mechanical Data (Package|Pins)
  • RWJ|41
Thermal pad, mechanical data (Package|Pins)

1 Feature

  • Peak current rating: 50 A
  • 16-V VIN, 25-V high-side and low-side FET
  • Adjusted deadtime trim to improve transient response with non-TI controller
  • Peak efficiency (fSW = 600 kHz, LOUT = 150 nH): over 94%
  • High-frequency operation (up to 1.75 MHz)
  • Temperature compensated bi-directional current sense
  • Analog temperature output
  • Fault monitoring
  • 3.3-V and 5-V PWM signal compatible
  • Tri-state PWM input
  • Integrated bootstrap switch
  • Optimized dead-time for shoot-through protection
  • High-density, QFN 5-mm × 6-mm footprint
  • Ultra-low-inductance package
  • System optimized PCB footprint
  • Thermally enhanced topside cooling
  • RoHS compliant, lead-free terminal plating
  • Halogen free