SLPS714A January   2019  – March 2019 CSD96497Q5MC

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
    1.     Device Images
      1.      Simplified Application
      2.      Typical Power Stage Efficiency
  4. 4Revision History
  5. 5Device and Documentation Support
    1. 5.1 Trademarks
    2. 5.2 Electrostatic Discharge Caution
    3. 5.3 Glossary
  6. 6Mechanical, Packaging, and Orderable Information
    1. 6.1 Mechanical Drawing
    2. 6.2 Recommended PCB Land Pattern
    3. 6.3 Recommended Stencil Opening
  7. 7Package Option Addendum
    1. 7.1 Packaging Information
    2. 7.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
  • DMC|12
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Mechanical Drawing

CSD96497Q5MC Mech.png
  1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
  2. This drawing is subject to change without notice.
  3. The package thermal pads must be soldered to the printed circuit board for thermal and mechanical performance.
  4. Exposed tie bar features may vary.