SNAS449F February   2008  – May 2017 DAC081C081 , DAC081C085

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1. 3.1 Block Diagram
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 AC and Timing Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DAC Section
      2. 8.3.2 Output Amplifier
      3. 8.3.3 Reference Voltage
      4. 8.3.4 Power-On Reset
      5. 8.3.5 Simultaneous Reset
      6. 8.3.6 Additional Timing Information: toutz
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Modes
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
      2. 8.5.2 Basic I2C Protocol
      3. 8.5.3 Standard-Fast Mode
      4. 8.5.4 High-Speed (Hs) Mode
      5. 8.5.5 I2C Slave (Hardware) Address
      6. 8.5.6 Writing to the DAC Register
      7. 8.5.7 Reading from the DAC Register
    6. 8.6 Registers
      1. 8.6.1 DAC Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Bipolar Operation
      2. 9.1.2 DSP/Microprocessor Interfacing
        1. 9.1.2.1 Interfacing to the 2-Wire Bus
        2. 9.1.2.2 Interfacing to a Hs-mode Bus
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Using References as Power Supplies
      1. 10.1.1 LM4132
      2. 10.1.2 LM4050
      3. 10.1.3 LP3985
      4. 10.1.4 LP2980
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
      2. 12.1.2 Device Nomenclature
        1. 12.1.2.1 Specification Definitions
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.