SNAS365G May   2006  – June 2016 DAC082S085

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
      1. 8.2.1 Feature Description
        1. 8.2.1.1 DAC Architecture
        2. 8.2.1.2 Output Amplifiers
        3. 8.2.1.3 Reference Voltage
        4. 8.2.1.4 Power-On Reset
    3. 8.3 Device Functional Modes
      1. 8.3.1 Power-Down Modes
    4. 8.4 Programming
      1. 8.4.1 Serial Interface
      2. 8.4.2 Input Shift Register
      3. 8.4.3 DSP and Microprocessor Interfacing
        1. 8.4.3.1 ADSP-2101/ADSP2103 Interfacing
        2. 8.4.3.2 80C51/80L51 Interface
        3. 8.4.3.3 68HC11 Interface
        4. 8.4.3.4 Microwire Interface
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Bipolar Operation
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Using References as Power Supplies
      1. 10.1.1 LM4130
      2. 10.1.2 LM4050
      3. 10.1.3 LP3985
      4. 10.1.4 LP2980
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
        1. 12.1.1.1 Specification Definitions
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resource
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.