SNAS362G May   2006  – April 2016 DAC104S085 , DAC104S085-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings - DAC104S085
    3. 7.3 ESD Ratings - DAC104S085-Q1
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Electrical Characteristics
    7. 7.7 Timing Requirements
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Output Amplifiers
      2. 8.3.2 Reference Voltage
      3. 8.3.3 Power-On Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Modes
      2. 8.4.2 Bipolar Operation
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
      2. 8.5.2 Input Shift Register
      3. 8.5.3 DSP and Microprocessor Interfacing
        1. 8.5.3.1 ADSP-2101 and ADSP2103 Interfacing
        2. 8.5.3.2 80C51 and 80L51 Interface
        3. 8.5.3.3 68HC11 Interface
        4. 8.5.3.4 Microwire Interface
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 LM4130
      2. 9.1.2 LP3985
      3. 9.1.3 LP2980
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
        1. 12.1.1.1 Specification Definitions
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Device Support

12.1.1 Device Nomenclature

12.1.1.1 Specification Definitions

    DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1 LSB, which is VREF / 1024 = VA / 1024.
    DAC-to-DAC CROSSTALK is the glitch impulse transferred to a DAC output in response to a full-scale change in the output of another DAC.
    DIGITAL CROSSTALKis the glitch impulse transferred to a DAC output at mid-scale in response to a full-scale change in the input register of another DAC.
    DIGITAL FEEDTHROUGH is a measure of the energy injected into the analog output of the DAC from the digital inputs when the DAC outputs are not updated. It is measured with a full-scale code change on the data bus.
    FULL-SCALE ERRORis the difference between the actual output voltage with a full scale code (3FFh) loaded into the DAC and the value of VA x 1023 / 1024.
    GAIN ERROR is the deviation from the ideal slope of the transfer function. It can be calculated from Zero and Full-Scale Errors as GE = FSE - ZE, where GE is Gain error, FSE is Full-Scale Error and ZE is Zero Error.
    GLITCH IMPULSEis the energy injected into the analog output when the input code to the DAC register changes. It is specified as the area of the glitch in nanovolt-seconds.
    INTEGRAL NON-LINEARITY (INL) is a measure of the deviation of each individual code from a straight line through the input to output transfer function. The deviation of any given code from this straight line is measured from the center of that code value. The end point method is used. INL for this product is specified over a limited range.
    LEAST SIGNIFICANT BIT (LSB)is the bit that has the smallest value or weight of all bits in a word. This value is
    Equation 6. LSB = VREF / 2n

    where

    • where VREF is the supply voltage for this product, and "n" is the DAC resolution in bits, which is 10 for the DAC104S085.
    MAXIMUM LOAD CAPACITANCE is the maximum capacitance that can be driven by the DAC with output stability maintained.
    MONOTONICITY is the condition of being monotonic, where the DAC has an output that never decreases when the input code increases.
    MOST SIGNIFICANT BIT (MSB) is the bit that has the largest value or weight of all bits in a word. Its value is 1/2 of VA.
    MULTIPLYING BANDWIDTHis the frequency at which the output amplitude falls 3dB below the input sine wave on VREFIN with a full-scale code loaded into the DAC.
    POWER EFFICIENCY is the ratio of the output current to the total supply current. The output current comes from the power supply. The difference between the supply and output currents is the power consumed by the device without a load.
    SETTLING TIME is the time for the output to settle to within 1/2 LSB of the final value after the input code is updated.
    TOTAL HARMONIC DISTORTION (THD)is the measure of the harmonics present at the output of the DACs with an ideal sine wave applied to VREFIN. THD is measured in dB.
    WAKE-UP TIMEis the time for the output to exit power-down mode. This is the time from the falling edge of the 16th SCLK pulse to when the output voltage deviates from the power-down voltage of 0V.
    ZERO CODE ERROR is the output error, or voltage, present at the DAC output after a code of 000h has been entered.

12.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 3. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
DAC104S085 Click here Click here Click here Click here Click here
DAC104S085-Q1 Click here Click here Click here Click here Click here

12.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.