SNAS362G May   2006  – April 2016 DAC104S085 , DAC104S085-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings - DAC104S085
    3. 7.3 ESD Ratings - DAC104S085-Q1
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Electrical Characteristics
    7. 7.7 Timing Requirements
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Output Amplifiers
      2. 8.3.2 Reference Voltage
      3. 8.3.3 Power-On Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Modes
      2. 8.4.2 Bipolar Operation
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
      2. 8.5.2 Input Shift Register
      3. 8.5.3 DSP and Microprocessor Interfacing
        1. 8.5.3.1 ADSP-2101 and ADSP2103 Interfacing
        2. 8.5.3.2 80C51 and 80L51 Interface
        3. 8.5.3.3 68HC11 Interface
        4. 8.5.3.4 Microwire Interface
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 LM4130
      2. 9.1.2 LP3985
      3. 9.1.3 LP2980
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
        1. 12.1.1.1 Specification Definitions
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from F Revision (March 2013) to G Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go

Changes from E Revision (March 2013) to F Revision

  • Changed layout of National Data Sheet to TI formatGo