SLASF03
December 2021
DAC11001B
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Timing Requirements: Write, 4.5 V ≤ DVDD ≤ 5.5 V
6.7
Timing Requirements: Write, 2.7 V ≤ DVDD < 4.5 V
6.8
Timing Requirements: Read and Daisy-Chain Write, 4.5 V ≤ DVDD ≤ 5.5 V
6.9
Timing Requirements: Read and Daisy-Chain Write, 2.7 V ≤ DVDD < 4.5 V
6.10
Timing Diagrams
6.11
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Digital-to-Analog Converter Architecture
7.3.2
External Reference
7.3.3
Output Buffers
7.3.4
Internal Power-On Reset (POR)
7.3.5
Temperature Drift and Calibration
7.3.6
DAC Output Deglitch Circuit
7.4
Device Functional Modes
7.4.1
Fast-Settling Mode and THD
7.4.2
DAC Update Rate Mode
7.5
Programming
7.5.1
Daisy-Chain Operation
7.5.2
CLR Pin Functionality and Software Clear
7.5.3
Output Update (Synchronous and Asynchronous)
7.5.3.1
Synchronous Update
7.5.3.2
Asynchronous Update
7.5.4
Software Reset Mode
7.6
Register Map
7.6.1
NOP Register (address = 00h) [reset = 0x000000h for bits [23:0]]
7.6.2
DAC-DATA Register (address = 01h) [reset = 0x000000h for bits [23:0]]
7.6.3
CONFIG1 Register (address = 02h) [reset = 004C80h for bits [23:0]]
7.6.4
DAC-CLEAR-DATA Register (address = 03h) [reset = 000000h for bits [23:0]]
7.6.5
TRIGGER Register (address = 04h) [reset = 000000h for bits [23:0]]
7.6.6
STATUS Register (address = 05h) [reset = 000000h for bits [23:0]]
7.6.7
CONFIG2 Register (address = 06h) [reset = 000040h for bits [23:0]]
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Source Measure Unit (SMU)
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.3
Application Curves
8.2.2
High-Precision Control Loop
8.2.2.1
Design Requirements
8.2.2.2
Detailed Design Procedure
8.2.2.3
Application Curves
8.2.3
Arbitrary Waveform Generation (AWG)
8.2.3.1
Design Requirements
8.2.3.2
Detailed Design Procedure
8.2.3.3
Application Curves
8.3
System Examples
8.3.1
Interfacing to a Processor
8.3.2
Interfacing to a Low-Jitter LDAC Source
8.3.3
Embedded Resistor Configurations
8.3.3.1
Minimizing Bias Current Mismatch
8.3.3.2
2x Gain Configuration
8.3.3.3
Generating Negative Reference
8.4
What to Do and What Not to Do
8.4.1
What to Do
8.4.2
What Not to Do
8.5
Initialization Set Up
9
Power Supply Recommendations
9.1
Power-Supply Sequencing
10
Layout
10.1
Layout Guidelines
10.1.1
PCB Assembly Effects on Precision
10.2
Layout Example
11
Device and Documentation Support
11.1
Device Support
11.1.1
Development Support
11.2
Documentation Support
11.2.1
Related Documentation
11.3
Receiving Notification of Documentation Updates
11.4
Support Resources
11.5
Trademarks
11.6
Electrostatic Discharge Caution
11.7
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
PFB|48
MTQF019B
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slasf03_oa
slasf03_pm
11.7
Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.