SLASF03 December   2021 DAC11001B

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: Write, 4.5 V ≤ DVDD ≤ 5.5 V
    7. 6.7  Timing Requirements: Write, 2.7 V ≤ DVDD < 4.5 V
    8. 6.8  Timing Requirements: Read and Daisy-Chain Write, 4.5 V ≤ DVDD ≤ 5.5 V
    9. 6.9  Timing Requirements: Read and Daisy-Chain Write, 2.7 V ≤ DVDD < 4.5 V
    10. 6.10 Timing Diagrams
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital-to-Analog Converter Architecture
      2. 7.3.2 External Reference
      3. 7.3.3 Output Buffers
      4. 7.3.4 Internal Power-On Reset (POR)
      5. 7.3.5 Temperature Drift and Calibration
      6. 7.3.6 DAC Output Deglitch Circuit
    4. 7.4 Device Functional Modes
      1. 7.4.1 Fast-Settling Mode and THD
      2. 7.4.2 DAC Update Rate Mode
    5. 7.5 Programming
      1. 7.5.1 Daisy-Chain Operation
      2. 7.5.2 CLR Pin Functionality and Software Clear
      3. 7.5.3 Output Update (Synchronous and Asynchronous)
        1. 7.5.3.1 Synchronous Update
        2. 7.5.3.2 Asynchronous Update
      4. 7.5.4 Software Reset Mode
    6. 7.6 Register Map
      1. 7.6.1 NOP Register (address = 00h) [reset = 0x000000h for bits [23:0]]
      2. 7.6.2 DAC-DATA Register (address = 01h) [reset = 0x000000h for bits [23:0]]
      3. 7.6.3 CONFIG1 Register (address = 02h) [reset = 004C80h for bits [23:0]]
      4. 7.6.4 DAC-CLEAR-DATA Register (address = 03h) [reset = 000000h for bits [23:0]]
      5. 7.6.5 TRIGGER Register (address = 04h) [reset = 000000h for bits [23:0]]
      6. 7.6.6 STATUS Register (address = 05h) [reset = 000000h for bits [23:0]]
      7. 7.6.7 CONFIG2 Register (address = 06h) [reset = 000040h for bits [23:0]]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Source Measure Unit (SMU)
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 High-Precision Control Loop
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Arbitrary Waveform Generation (AWG)
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Interfacing to a Processor
      2. 8.3.2 Interfacing to a Low-Jitter LDAC Source
      3. 8.3.3 Embedded Resistor Configurations
        1. 8.3.3.1 Minimizing Bias Current Mismatch
        2. 8.3.3.2 2x Gain Configuration
        3. 8.3.3.3 Generating Negative Reference
    4. 8.4 What to Do and What Not to Do
      1. 8.4.1 What to Do
      2. 8.4.2 What Not to Do
    5. 8.5 Initialization Set Up
  9. 9 Power Supply Recommendations
    1. 9.1 Power-Supply Sequencing
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Assembly Effects on Precision
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Timing Requirements: Write, 4.5 V ≤ DVDD ≤ 5.5 V

all input signals are specified with tR = tF = 1 ns/V (10% to 90% of IOVDD) and timed from a voltage level of (VIL + VIH) / 2,
SDO loaded with 20 pF, and TA = –40°C to +125°C (unless otherwise noted)
MIN NOM MAX UNIT
fSCLK SCLK frequency, 1.7 V ≤ IOVDD < 2.7 V 33 MHz
SCLK frequency, 2.7 V ≤ IOVDD ≤ 5.5 V 50
tSCLKHIGH SCLK high time, 1.7 V ≤ IOVDD < 2.7 V 15 ns
SCLK high time, 2.7 V ≤ IOVDD ≤ 5.5 V 10
tSCLKLOW SCLK low time, 1.7 V ≤ IOVDD < 2.7 V 15 ns
SCLK low time, 2.7 V ≤ IOVDD ≤ 5.5 V 10
tSDIS SDI setup, 1.7 V ≤ IOVDD < 2.7 V 13 ns
SDI setup, 2.7 V ≤ IOVDD ≤ 5.5 V 8
tSDIH SDI hold, 1.7 V ≤ IOVDD < 2.7 V 13 ns
SDI hold, 2.7 V ≤ IOVDD ≤ 5.5 V 8
tCSS SYNC falling edge to SCLK falling edge, 1.7 V ≤ IOVDD < 2.7 V 23 ns
SYNC falling edge to SCLK falling edge, 2.7 V ≤ IOVDD ≤ 5.5 V 18
tCSH SCLK falling edge to SYNC rising edge, 1.7 V ≤ IOVDD < 2.7 V 15 ns
SCLK falling edge to SYNC rising edge, 2.7 V ≤ IOVDD ≤ 5.5 V 10
tCSHIGH SYNC high time, 1.7 V ≤ IOVDD < 2.7 V 55 ns
SYNC high time, 2.7 V ≤ IOVDD ≤ 5.5 V 50
tCSIGNORE SCLK falling edge to SYNC ignore, 1.7 V ≤ IOVDD < 2.7 V 10 ns
SCLK falling edge to SYNC ignore, 2.7 V ≤ IOVDD ≤ 5.5 V 5
tLDACSL Synchronous update:
SYNC rising edge to LDAC falling edge, 1.7 V ≤ IOVDD < 2.7 V		 50 ns
Synchronous update:
SYNC rising edge to LDAC falling edge, 2.7 V ≤ IOVDD ≤ 5.5 V		 50
tLDACW LDAC low time, 1.7 V ≤ IOVDD < 2.7 V 20 ns
LDAC low time, 2.7 V ≤ IOVDD ≤ 5.5 V 20
tCLRW CLR low time, 1.7 V ≤ IOVDD < 2.7 V 20 ns
CLR low time, 2.7 V ≤ IOVDD ≤ 5.5 V 20