SNAS395F December   2007  – October 2016 DAC121C081 , DAC121C085

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 AC and Timing Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DAC Section
      2. 8.3.2 Output Amplifier
      3. 8.3.3 Reference Voltage
      4. 8.3.4 Serial Interface
        1. 8.3.4.1 Basic I2C Protocol
        2. 8.3.4.2 Standard-Fast Mode
        3. 8.3.4.3 High-Speed (Hs) Mode
        4. 8.3.4.4 I2C Slave (Hardware) Address
      5. 8.3.5 Power-On Reset
      6. 8.3.6 Simultaneous Reset
      7. 8.3.7 Additional Timing Information: toutz
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Modes
    5. 8.5 Programming
      1. 8.5.1 Writing to the DAC Register
      2. 8.5.2 Reading from the DAC Register
    6. 8.6 Registers
      1. 8.6.1 DAC Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Bipolar Operation
      2. 9.1.2 DSP/Microprocessor Interfacing
        1. 9.1.2.1 Interfacing to the 2-wire Bus
        2. 9.1.2.2 Interfacing to a Hs-mode Bus
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Using References as Power Supplies
      1. 10.1.1 LM4132
      2. 10.1.2 LM4050
      3. 10.1.3 LP3985
      4. 10.1.4 LP2980
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
        1. 12.1.1.1 Specification Definitions
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from E Revision (January 2016) to F Revision

  • Changed VOUT and VA descriptions.Go
  • Added column to Table 1. Go

Changes from D Revision (March 2013) to E Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go
  • Added addresses that the DAC responds to on the I2C bus. Go

Changes from C Revision (March 2013) to D Revision

  • Changed layout of National Semiconductor Data Sheet to TI formatGo