SNAS395F December   2007  – October 2016 DAC121C081 , DAC121C085

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 AC and Timing Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DAC Section
      2. 8.3.2 Output Amplifier
      3. 8.3.3 Reference Voltage
      4. 8.3.4 Serial Interface
        1. 8.3.4.1 Basic I2C Protocol
        2. 8.3.4.2 Standard-Fast Mode
        3. 8.3.4.3 High-Speed (Hs) Mode
        4. 8.3.4.4 I2C Slave (Hardware) Address
      5. 8.3.5 Power-On Reset
      6. 8.3.6 Simultaneous Reset
      7. 8.3.7 Additional Timing Information: toutz
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Modes
    5. 8.5 Programming
      1. 8.5.1 Writing to the DAC Register
      2. 8.5.2 Reading from the DAC Register
    6. 8.6 Registers
      1. 8.6.1 DAC Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Bipolar Operation
      2. 9.1.2 DSP/Microprocessor Interfacing
        1. 9.1.2.1 Interfacing to the 2-wire Bus
        2. 9.1.2.2 Interfacing to a Hs-mode Bus
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
    1. 10.1 Using References as Power Supplies
      1. 10.1.1 LM4132
      2. 10.1.2 LM4050
      3. 10.1.3 LP3985
      4. 10.1.4 LP2980
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
        1. 12.1.1.1 Specification Definitions
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)(3)
MIN MAX UNIT
Supply voltage, VA –0.3 6.5 V
Voltage on any input pin –0.3 6.5 V
Input current at any pin(4) ±10 mA
Package input current(4) ±20 mA
Power consumption at TA = 25°C See(5)
Junction temperature, TJ 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are measured with respect to GND = 0 V, unless otherwise specified.
(3) If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and specifications.
(4) When the input voltage at any pin exceeds 5.5 V or is less than GND, the current at that pin should be limited to 10 mA. The 20-mA maximum package input current ratings limits the number of pins that can safely exceed the power supplies with an input current of 10 mA to two.
(5) The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA), and can be calculated using the formula PDMAX = (TJmax − TA) / θJA. The values for maximum power dissipation will be reached only when the device is operated in a severe fault condition (for example, when input or output pins are driven beyond the operating ratings, or the power supply polarity is reversed).

7.2 ESD Ratings

VALUE UNIT
DAC081C081 in NGF Package
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 All pins except 2 and 3 ±2500 V
Pins 2 and 3 ±5000
Charged-device model (CDM), per JEDEC specification JESD22-C101 All pins except 2 and 3 ±1000
Pins 2 and 3 ±1000
Machine model (MM) All pins except 2 and 3 ±250
Pins 2 and 3 ±350
DAC081C081 in DDC Package
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 All pins except 4 and 5 ±2500 V
Pins 4 and 5 ±5000
Charged-device model (CDM), per JEDEC specification JESD22-C101 All pins except 4 and 5 ±1000
Pins 4 and 5 ±1000
Machine model (MM) All pins except 4 and 5 ±250
Pins 4 and 5 ±350
DAC081C085 in DGK Package
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 All pins except 3 and 4 ±2500 V
Pins 3 and 4 ±5000
Charged-device model (CDM), per JEDEC specification JESD22-C101 All pins except 3 and 4 ±1000
Pins 3 and 4 ±1000
Machine model (MM) All pins except 3 and 4 ±250
Pins 3 and 4 ±350

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Operating temperature, TA −40 125 °C
Supply voltage, VA 2.7 5.5 V
Reference voltage, VREFIN 1 VA V
Digital input voltage(2) 0 5.5 V
Output load 0 1500 pF
(1) All voltages are measured with respect to GND = 0 V, unless otherwise specified.
(2) The inputs are protected as shown in the following. Input voltage magnitudes up to 5.5 V, regardless of VA, will not cause errors in the conversion result. For example, if VA is 3 V, the digital input pins can be driven with a 5-V logic device.

7.4 Thermal Information

THERMAL METRIC(1)(2)(3) DAC121C081 DAC121C085 UNIT
NGF (WSON) DDC (SOT) DGK (VSSOP)
6 PINS 6 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 190 250 240 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Soldering process must comply with Texas Instruments' Reflow Temperature Profile Specifications, SNOA549.
(3) Reflow temperature profiles are different for lead-free packages.

7.5 Electrical Characteristics

The following specifications apply for VA = 2.7 V to 5.5 V, VREF = VA, CL = 200 pF to GND, input code range 48 to 4047. All Maximum and Minimum limits apply for TMIN ≤ TA ≤ TMAX and all Typical limits are at TA = 25°C, unless otherwise specified.(1)
PARAMETER TEST CONDITIONS MIN TYP(3) MAX(3) UNIT
STATIC PERFORMANCE
INL Resolution 12 Bits
Monotonicity 12 Bits
Integral Non-Linearity 2.2 8 LSB
–8 –1.5
DNL Differential Non-Linearity 0.18 0.6 LSB
–0.5 –0.12 LSB
ZE Zero Code Error IOUT = 0 1.1 10 mV
FSE Full-Scale Error IOUT = 0 –0.1 −0.7 %FSR
GE Gain Error All ones Loaded to DAC register –0.2 −0.7 %FSR
ZCED Zero Code Error Drift –20 µV/°C
TC GE Gain Error Tempco VA = 3 V –0.7 ppm FSR/°C
VA = 5 V –1
ANALOG OUTPUT CHARACTERISTICS (VOUT)
Output voltage range(4) DAC121C085 0 VREF V
DAC121C081 0 VA
ZCO Zero code output VA = 3 V, IOUT = 200 µA 1.3 mV
VA = 5 V, IOUT = 200 µA 7
FSO Full scale output VA = 3 V, IOUT = 200 µA 2.984 V
VA = 5 V, IOUT = 200 µA 4.989
IOS Output short-circuit current
(ISOURCE)		 VA = 3 V, VOUT = 0 V,
Input Code = FFFh. 		56 mA
VA = 5 V, VOUT = 0 V,
Input Code = FFFh. 		69
IOS Output short-circuit current
(ISINK)		 VA = 3 V, VOUT = 3 V,
Input Code = 000h.		 –52 mA
VA = 5 V, VOUT = 5 V,
Input Code = 000h.		 –75
IO Continuous output current(4) Available on the DAC output 11 mA
CL Maximum load capacitance RL = ∞ 1500 pF
RL = 2 kΩ 1500
ZOUT DC output impedance 7.5 Ω
REFERENCE INPUT CHARACTERISTICS (DAC121C085 only)
VREF Input range minimum 1 0.2 V
Input range maximum VA V
Input impedance 120 kΩ
LOGIC INPUT CHARACTERISTICS (SCL, SDA)
VIH Input high voltage 0.7 × VA V
VIL Input low voltage 0.3 × VA V
IIN Input current ±1 µA
CIN Input pin capacitance(4) 3 pF
VHYST Input hysteresis 0.1 × VA V
LOGIC INPUT CHARACTERISTICS (ADR0, ADR1)
VIH Input high voltage VA- 0.5 V
VIL Input low voltage 0.5 V
IIN Input current ±1 µA
LOGIC OUTPUT CHARACTERISTICS (SDA)
VOL Output low voltage ISINK = 3 mA 0.4 V
ISINK = 6 mA 0.6
IOZ High-impedence output leakage current ±1 µA
POWER REQUIREMENTS
VA Supply voltage minimum 2.7 V
Supply voltage maximum 5.5
Normal -- VOUT set to midscale. 2-wire interface quiet (SCL = SDA = VA). (output unloaded)
IST_VA-1 VADAC121C081 supply current VA = 2.7 V to 3.6 V 105 156 µA
VA = 4.5 V to 5.5 V 132 214
IST_VA-5 VADAC121C085 supply current VA = 2.7 V to 3.6 V 86 118 µA
VA = 4.5 V to 5.5 V 98 152
IST_VREF VREF supply current
(DAC121C085 only)		 VA = 2.7 V to 3.6 V 37 43 µA
VA = 4.5 V to 5.5 V 53 61
PST Power consumption
(VA and VREF for DAC121C085)(2)		 VA = 3 V 380 µW
VA = 5 V 730
Continuous Operation -- 2-wire interface actively addressing the DAC and writing to the DAC register. (output unloaded)
ICO_VA-1 VADAC121C081 supply current fSCL=400 kHz VA = 2.7 V to 3.6 V 134 220 µA
VA = 4.5 V to 5.5 V 192 300
fSCL = 3.4 MHz VA = 2.7 V to 3.6 V 225 320 µA
VA = 4.5 V to 5.5 V 374 500
ICO_VA-5 VADAC121C085 supply current fSCL = 400 kHz VA = 2.7 V to 3.6 V 101 155 µA
VA = 4.5 V to 5.5 V 142 220
fSCL = 3.4 MHz VA = 2.7 V to 3.6 V 193 235 µA
VA = 4.5 V to 5.5 V 325 410
ICO_VREF VREF supply current
(DAC121C085 only)		 VA = 2.7 V to 3.6 V 33.5 55 µA
VA = 4.5 V to 5.5 V 49.5 71.4
PCO Power consumption
(VA and VREF for DAC121C085) 		fSCL = 400 kHz VA = 3 V 480 µW
VA = 5 V 1.06 mW
fSCL = 3.4 MHz VA = 3 V 810 µW
VA = 5 V 2.06 mW
Power Down -- 2-wire interface quiet (SCL = SDA = VA) after PD mode written to DAC register. (output unloaded)
IPD Supply current
(VA and VREF for DAC121C085)		 All power-down modes VA = 2.7 V to 3.6 0.13 1.52 µA
VA = 4.5 V to 5.5 V 0.15 3.25
PPD Power consumption
(VA and VREF for DAC121C085)		 All power-down modes VA = 3 V 0.5 µW
VA = 5 V 0.9
(1) Values shown in this table are design targets and are subject to change before product release.

7.6 AC and Timing Characteristics

The following specifications apply for VA = 2.7 V to 5.5 V, VREF = VA, RL = Infinity, CL = 200 pF to GND. All Maximum and Minimum limits apply for TMIN ≤ TA ≤ TMAX and all Typical limits are at TA = 25°C, unless otherwise specified.(1)
PARAMETER TEST CONDITIONS(7) MIN TYP(3) MAX(7)(3) UNIT
ts Output Voltage Settling Time(4) 400h to C00h code change
RL = 2 kΩ, CL = 200 pF		 6 8.5 µs
SR Output Slew Rate 1 V/µs
Glitch Impulse Code change from 800h to 7FFh 12 nV-sec
Digital Feedthrough 0.5 nV-sec
Multiplying Bandwidth(6) VREF = 2.5 V ± 0.1 Vpp 160 kHz
Total Harmonic Distortion(6) VREF = 2.5 V ± 0.1 Vpp
input frequency = 10 kHz		 70 dB
tWU Wake-Up Time VA = 3 V 0.8 µs
VA = 5 V 0.5 µs
DIGITAL TIMING SPECS (SCL, SDA)
fSCL Serial Clock Frequency Standard Mode 100 kHz
Fast Mode 400
High Speed Mode, Cb = 100 pF 3.4 MHz
High Speed Mode, Cb = 400 pF 1.7
tLOW SCL Low Time Standard Mode 4.7 µs
Fast Mode 1.3
High Speed Mode, Cb = 100 pF 160 ns
High Speed Mode, Cb = 400 pF 320
tHIGH SCL High Time Standard Mode 4 µs
Fast Mode 0.6
High Speed Mode, Cb = 100 pF 60 ns
High Speed Mode, Cb = 400 pF 120
tSU;DAT Data Setup Time Standard Mode 250 ns
Fast Mode 100
High Speed Mode 10
tHD;DAT Data Hold Time Standard Mode 0 3.45 µs
Fast Mode 0 0.9
High Speed Mode, Cb = 100 pF 0 70 ns
High Speed Mode, Cb = 400 pF 0 150
tSU;STA Setup time for a start or a repeated start condition Standard Mode 4.7 µs
Fast Mode 0.6
High Speed Mode 160 ns
tHD;STA Hold time for a start or a repeated start condition Standard Mode 4 µs
Fast Mode 0.6
High Speed Mode 160 ns
tBUF Bus free time between a stop and start condition Standard Mode 4.7 µs
Fast Mode 1.3
tSU;STO Setup time for a stop condition Standard Mode 4 µs
Fast Mode 0.6
High Speed Mode 160 ns
trDA Rise time of SDA signal Standard Mode 1000 ns
Fast Mode 20+0.1Cb 300
High Speed Mode, Cb = 100 pF 10 80
High Speed Mode, Cb = 400 pF 20 160
tfDA Fall time of SDA signal Standard Mode 250 ns
Fast Mode 20+0.1Cb 250
High Speed Mode, Cb = 100 pF 10 80
High Speed Mode, Cb = 400 pF 20 160
trCL Rise time of SCL signal Standard Mode 1000 ns
Fast Mode 20+0.1Cb 300
High Speed Mode, Cb = 100 pF 10 40
High Speed Mode, Cb = 400 pF 20 80
trCL1 Rise time of SCL signal after a repeated start condition and after an acknowledge bit. Standard Mode 1000 ns
Fast Mode 20+0.1Cb 300
High Speed Mode, Cb = 100 pF 10 80
High Speed Mode, Cb = 400 pF 20 160
tfCL Fall time of a SCL signal Standard Mode 300 ns
Fast Mode 20+0.1Cb 300
High Speed Mode, Cb = 100 pF 10 40
High Speed Mode, Cb = 400 pF 20 80
Cb Capacitive load for each bus line (SCL and SDA) 400 pF
tSP Pulse Width of spike suppressed(5)(4) Fast Mode 50 ns
High Speed Mode 10
toutz SDA output delay (see the Additional Timing Information section) Fast Mode 87 270 ns
High Speed Mode 38 60
(1) Values shown in this table are design targets and are subject to change before product release.
(2) To ensure accuracy, it is required that VA and VREF be well bypassed.
(3) Typical figures are at TJ = 25°C, and represent most likely parametric norms. Test limits are specified to AOQL (Average Outgoing Quality Level).
(4) This parameter is specified by design and/or characterization and is not tested in production.
(5) Spike suppression filtering on SCL and SDA will supress spikes that are less than 50 ns for standard-fast mode and less than 10ns for hs-mode.
(6) Applies to the Multiplying DAC configuration. In this configuration, the reference is used as the analog input. The value loaded in the DAC Register will digitally attenuate the signal at Vout.
(7) Cb refers to the capacitance of one bus line. Cb is expressed in pF units.
DAC121C081 DAC121C085 30004905.gif Figure 1. Input / Output Transfer Characteristic
DAC121C081 DAC121C085 30004960.gif Figure 2. Serial Timing Diagram

7.7 Typical Characteristics

VREF = VA, fSCL = 3.4 MHz, TA = 25°C, Input Code Range 48 to 4047, unless otherwise stated.
DAC121C081 DAC121C085 30004920.png Figure 3. INL
DAC121C081 DAC121C085 30004922.png Figure 5. INL/DNL vs Temperature at VA = 3 V
DAC121C081 DAC121C085 30004924.png Figure 7. INL/DNL vs VREFIN at VA = 3 V
DAC121C081 DAC121C085 30004926.png Figure 9. INL/DNL vs VA
DAC121C081 DAC121C085 30004928.png Figure 11. Zero Code Error vs Temperature
DAC121C081 DAC121C085 30004929.png Figure 13. Full Scale Error vs Temperature
DAC121C081 DAC121C085 30004931.png Figure 15. VREF Supply Current vs VA
DAC121C081 DAC121C085 30004933.png Figure 17. Total Supply Current vs Temperature at VA = 5 V
DAC121C081 DAC121C085 30004935.png Figure 19. Power-On Reset
DAC121C081 DAC121C085 30004921.png Figure 4. DNL
DAC121C081 DAC121C085 30004923.png Figure 6. INL/DNL vs Temperature at VA = 5 V
DAC121C081 DAC121C085 30004925.png Figure 8. INL/DNL vs VREFIN at VA = 5 V
DAC121C081 DAC121C085 30004927.png Figure 10. Zero Code Error vs VA
DAC121C081 DAC121C085 30004936.png Figure 12. Full Scale Error vs VA
DAC121C081 DAC121C085 30004930.png Figure 14. Total Supply Current vs VA
DAC121C081 DAC121C085 30004932.png Figure 16. Total Supply Current vs Temperature at VA = 3 V
DAC121C081 DAC121C085 30004934.png Figure 18. 5-V Glitch Response