SNAS621A JUNE   2013  – December 2014 DAC161S997

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Error Detection And Reporting
        1. 8.3.1.1 Loop Error
        2. 8.3.1.2 SPI Timeout Error (Channel Error)
        3. 8.3.1.3 Frame Error
        4. 8.3.1.4 Alarm Current
    4. 8.4 Device Functional Modes
      1. 8.4.1 Serial Interface
        1. 8.4.1.1 SPI Write
        2. 8.4.1.2 SPI Read
        3. 8.4.1.3 Optional Protected SPI Writes
          1. 8.4.1.3.1 SPI Write Error Correction
    5. 8.5 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 16-bit Dac And Loop Drive
        1. 9.1.1.1 DC Characteristics
        2. 9.1.1.2 DC Input-Output Transfer Function
        3. 9.1.1.3 Loop Interface
        4. 9.1.1.4 Loop Compliance
        5. 9.1.1.5 AC Characteristics
          1. 9.1.1.5.1 Step Response
          2. 9.1.1.5.2 Output Impedance
          3. 9.1.1.5.3 PSRR
          4. 9.1.1.5.4 Stability
          5. 9.1.1.5.5 Noise and Ripple
          6. 9.1.1.5.6 Digital Feedthrough
          7. 9.1.1.5.7 HART Signal Injection
          8. 9.1.1.5.8 RC Filter Limitation
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Reasons for Choosing a 3.9-V Zener Diode
        2. 9.2.2.2 Loop Compliance Voltage
        3. 9.2.2.3 Selection of External BJT
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Trademarks

All other trademarks are the property of their respective owners.

12.2 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.3 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.