SNAS621A JUNE   2013  – December 2014 DAC161S997

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Error Detection And Reporting
        1. 8.3.1.1 Loop Error
        2. 8.3.1.2 SPI Timeout Error (Channel Error)
        3. 8.3.1.3 Frame Error
        4. 8.3.1.4 Alarm Current
    4. 8.4 Device Functional Modes
      1. 8.4.1 Serial Interface
        1. 8.4.1.1 SPI Write
        2. 8.4.1.2 SPI Read
        3. 8.4.1.3 Optional Protected SPI Writes
          1. 8.4.1.3.1 SPI Write Error Correction
    5. 8.5 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 16-bit Dac And Loop Drive
        1. 9.1.1.1 DC Characteristics
        2. 9.1.1.2 DC Input-Output Transfer Function
        3. 9.1.1.3 Loop Interface
        4. 9.1.1.4 Loop Compliance
        5. 9.1.1.5 AC Characteristics
          1. 9.1.1.5.1 Step Response
          2. 9.1.1.5.2 Output Impedance
          3. 9.1.1.5.3 PSRR
          4. 9.1.1.5.4 Stability
          5. 9.1.1.5.5 Noise and Ripple
          6. 9.1.1.5.6 Digital Feedthrough
          7. 9.1.1.5.7 HART Signal Injection
          8. 9.1.1.5.8 RC Filter Limitation
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Reasons for Choosing a 3.9-V Zener Diode
        2. 9.2.2.2 Loop Compliance Voltage
        3. 9.2.2.3 Selection of External BJT
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.