SNAS621A JUNE   2013  – December 2014 DAC161S997

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Error Detection And Reporting
        1. 8.3.1.1 Loop Error
        2. 8.3.1.2 SPI Timeout Error (Channel Error)
        3. 8.3.1.3 Frame Error
        4. 8.3.1.4 Alarm Current
    4. 8.4 Device Functional Modes
      1. 8.4.1 Serial Interface
        1. 8.4.1.1 SPI Write
        2. 8.4.1.2 SPI Read
        3. 8.4.1.3 Optional Protected SPI Writes
          1. 8.4.1.3.1 SPI Write Error Correction
    5. 8.5 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 16-bit Dac And Loop Drive
        1. 9.1.1.1 DC Characteristics
        2. 9.1.1.2 DC Input-Output Transfer Function
        3. 9.1.1.3 Loop Interface
        4. 9.1.1.4 Loop Compliance
        5. 9.1.1.5 AC Characteristics
          1. 9.1.1.5.1 Step Response
          2. 9.1.1.5.2 Output Impedance
          3. 9.1.1.5.3 PSRR
          4. 9.1.1.5.4 Stability
          5. 9.1.1.5.5 Noise and Ripple
          6. 9.1.1.5.6 Digital Feedthrough
          7. 9.1.1.5.7 HART Signal Injection
          8. 9.1.1.5.8 RC Filter Limitation
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Reasons for Choosing a 3.9-V Zener Diode
        2. 9.2.2.2 Loop Compliance Voltage
        3. 9.2.2.3 Selection of External BJT
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

RGH Package
16-Pin WQFN
(Top View)
DAC161S997 po_snas621.gif

Pin Functions

PIN TYPE(1) DESCRIPTION
NAME NO.
BASE 16 A External NPN base drive
COMA 1 P Analog-block negative supply rail (local COMMON)
COMD 2 P Digital-block negative supply rail (local COMMON)
CSB 6 I SPI chip select
C1 14 A External capacitor
C2 13 A External capacitor, HART input
C3 12 A External capacitor
EERB 7 O Error flag output, open drain, active LOW
ERRLVL 10 I Sets output-current level at power up and under-error conditions.
NC 11 – Do not connect to this pin.
OUT 9 A Loop output current source output
SCLK 4 I SPI clock input
SDI 5 I SPI data input
SDO 8 O SPI data output
VA 15 P Analog-block positive supply rail
VD 3 P Digital-block positive supply rail.
DAP DAP P Die attach pad. Connect directly to local COMMON (COMA, COMD).
(1) G = Ground, I = Digital Input, O = Digital Output, P = Power, A = Analog