SLAS959D August 2013 – February 2018 DAC3151 , DAC3161 , DAC3171
PRODUCTION DATA.
THERMAL METRIC(1) | DAC31x1 | UNIT | |
---|---|---|---|
RGC (VQFN) | |||
64 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 23.0 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 7.6 | °C/W |
RθJB | Junction-to-board thermal resistance | 2.8 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.1 | °C/W |
ψJB | Junction-to-board characterization parameter | 2.8 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 0.2 | °C/W |