SLASEA3D December 2016 – December 2023 DAC38RF80 , DAC38RF83 , DAC38RF84 , DAC38RF85 , DAC38RF90 , DAC38RF93
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | AAV (FCBGA) | UNIT | |
---|---|---|---|
144 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 25 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 1.0 | °C/W |
RθJB | Junction-to-board thermal resistance | 7.7 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.1 | °C/W |
ψJB | Junction-to-board characterization parameter | 7.7 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |