SLASEW8A October   2020  – September 2023 DAC43701-Q1 , DAC53701-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: I2C Standard Mode
    7. 6.7  Timing Requirements: I2C Fast Mode
    8. 6.8  Timing Requirements: I2C Fast-Mode Plus
    9. 6.9  Timing Requirements: GPI
    10. 6.10 Timing Diagram
    11. 6.11 Typical Characteristics: VDD = 5.5 V (Reference = VDD) or VDD = 5 V (Internal Reference)
    12. 6.12 Typical Characteristics: VDD = 1.8 V (Reference = VDD) or VDD = 2 V (Internal Reference)
    13. 6.13 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital-to-Analog Converter (DAC) Architecture
        1. 7.3.1.1 Reference Selection and DAC Transfer Function
          1. 7.3.1.1.1 Power Supply as Reference
          2. 7.3.1.1.2 Internal Reference
      2. 7.3.2 General-Purpose Input (GPI)
      3. 7.3.3 DAC Update
        1. 7.3.3.1 DAC Update Busy
      4. 7.3.4 Nonvolatile Memory (EEPROM or NVM)
        1. 7.3.4.1 NVM Cyclic Redundancy Check
        2. 7.3.4.2 NVM_CRC_ALARM_USER Bit
        3. 7.3.4.3 NVM_CRC_ALARM_INTERNAL Bit
      5. 7.3.5 Programmable Slew Rate
      6. 7.3.6 Power-On Reset (POR)
      7. 7.3.7 Software Reset
      8. 7.3.8 Device Lock Feature
      9. 7.3.9 PMBus Compatibility
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Down Mode
      2. 7.4.2 Continuous Waveform Generation (CWG) Mode
      3. 7.4.3 PMBus Compatibility Mode
    5. 7.5 Programming
      1. 7.5.1 F/S Mode Protocol
      2. 7.5.2 I2C Update Sequence
        1. 7.5.2.1 Address Byte
          1. 7.5.2.1.1 Target Address Configuration
        2. 7.5.2.2 Command Byte
      3. 7.5.3 I2C Read Sequence
    6. 7.6 Register Map
      1. 7.6.1  STATUS Register (address = D0h) [reset = 000Ch or 0014h]
      2. 7.6.2  GENERAL_CONFIG Register (address = D1h) [reset = 01F0h]
      3. 7.6.3  CONFIG2 Register (address = D2h) [reset = device-specific]
      4. 7.6.4  TRIGGER Register (address = D3h) [reset = 0008h]
      5. 7.6.5  DAC_DATA Register (address = 21h) [reset = 0000h]
      6. 7.6.6  DAC_MARGIN_HIGH Register (address = 25h) [reset = device-specific]
      7. 7.6.7  DAC_MARGIN_LOW Register (address = 26h) [reset =device-specific]
      8. 7.6.8  PMBUS_OPERATION Register (address = 01h) [reset = 0000h]
      9. 7.6.9  PMBUS_STATUS_BYTE Register (address = 78h) [reset = 0000h]
      10. 7.6.10 PMBUS_VERSION Register (address = 98h) [reset = 2200h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Power-Supply Margining
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 LED Thermal Foldback
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

Figure 5-1 DSG Package, 8-Pin WSON (Top View)
Table 5-1 Pin Functions
PIN TYPE DESCRIPTION
NO. NAME
1 GPI Input General-purpose input.
2 SCL Input Serial interface clock. This pin must be connected to the supply voltage with an external pullup resistor.
3 SDA Input/Output Data are clocked into or out of the input register. This pin is a bidirectional, and must be connected to the supply voltage with an external pullup resistor.
4 CAP Input External capacitor for the internal LDO. Connect a capacitor (approximately 1.5 µF) between CAP and AGND.
5 AGND Ground Ground reference point for all circuitry on the device.
6 VDD Power Analog supply voltage: 1.8 V to 5.5 V
7 FB Input Voltage-feedback pin.
8 OUT Output Analog output voltage from DAC.
— Thermal Pad Ground Connect the thermal pad to AGND.