SBAS442D august   2008  – august 2023 DAC5311 , DAC6311 , DAC7311

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Device Comparison
  7. Pin Configuration and Functions
  8. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements
    7. 7.7  Timing Diagrams
    8. 7.8  Typical Characteristics: AVDD = 5 V
    9. 7.9  Typical Characteristics: AVDD = 3.6 V
    10. 7.10 Typical Characteristics: AVDD = 2.7 V
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DAC Section
      2. 8.3.2 Resistor String
      3. 8.3.3 Output Amplifier
      4. 8.3.4 Power-On Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Modes
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Input Shift Register
        2. 8.5.1.2 SYNC Interrupt
  10. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Microprocessor Interfacing
        1. 9.1.1.1 DACx311 to 8051 Interface
        2. 9.1.1.2 DACx311 to Microwire Interface
        3. 9.1.1.3 DACx311 to 68HC11 Interface
    2. 9.2 Typical Applications
      1. 9.2.1 Loop Powered Transmitter
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Using the REF5050 as a Power Supply for the DACx311
      3. 9.2.3 Bipolar Operation Using the DACx311
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Power-Down Modes

The DACx311 contain four separate modes of operation. These modes are programmable by setting two bits (PD1 and PD0) in the control register. Table 8-1 shows how the state of the bits corresponds to the mode of operation of the device.

Table 8-1 Modes of Operation for the DACx311
PD1 PD0 OPERATING MODE
NORMAL MODE
0 0 Normal Operation
POWER-DOWN MODES
0 1 Output 1 kΩ to GND
1 0 Output 100 kΩ to GND
1 1 High-Z

When both bits are set to 0, the device works normally with a standard power consumption of typically 80 μA at 2 V. However, for the three power-down modes, the typical supply current falls to 0.5 μA at 5 V, 0.4 μA at 3 V, and 0.1 μA at 2 V. Not only does the supply current fall, but the output stage is also internally switched from the output of the amplifier to a resistor network of known values. The advantage of this architecture is that the output impedance of the part is known while the part is in power-down mode. There are three different options: the output is connected internally to GND either through a 1-kΩ resistor or a 100-kΩ resistor, or is left open-circuited (High-Z). Figure 8-3 illustrates the output stage.

GUID-AE33DE19-A8C5-4358-834A-492C8776C695-low.gif Figure 8-3 Output Stage During Power-Down

All linear circuitry is shut down when the power-down mode is activated. However, the contents of the DAC register are unaffected when in power-down. The time to exit power-down is typically 50 μs for AVDD = 5 V and AVDD = 3 V.