SBAS442D august   2008  – august 2023 DAC5311 , DAC6311 , DAC7311

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements
    7. 7.7  Timing Diagrams
    8. 7.8  Typical Characteristics: AVDD = 5 V
    9. 7.9  Typical Characteristics: AVDD = 3.6 V
    10. 7.10 Typical Characteristics: AVDD = 2.7 V
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DAC Section
      2. 8.3.2 Resistor String
      3. 8.3.3 Output Amplifier
      4. 8.3.4 Power-On Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Modes
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Input Shift Register
        2. 8.5.1.2 SYNC Interrupt
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Microprocessor Interfacing
        1. 9.1.1.1 DACx311 to 8051 Interface
        2. 9.1.1.2 DACx311 to Microwire Interface
        3. 9.1.1.3 DACx311 to 68HC11 Interface
    2. 9.2 Typical Applications
      1. 9.2.1 Loop Powered Transmitter
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Using the REF5050 as a Power Supply for the DACx311
      3. 9.2.3 Bipolar Operation Using the DACx311
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1.1.1 DACx311 to 8051 Interface

Figure 9-1 shows a serial interface between the DACx311 and a typical 8051-type microcontroller. The setup for the interface is as follows: TXD of the 8051 drives SCLK of the DACx311, while RXD drives the serial data line of the device. The SYNC signal is derived from a bit programmable pin on the port. In this case, port line P3.3 is used. When data are to be transmitted to the DACx311, P3.3 is taken low. The 8051 transmits data only in 8-bit bytes; thus, only eight falling clock edges occur in the transmit cycle. To load data to the DAC, P3.3 remains low after the first eight bits are transmitted, and a second write cycle is initiated to transmit the second byte of data. P3.3 is taken high following the completion of this cycle. The 8051 outputs the serial data in a format that has the LSB first. The DACx311 requires data with the MSB as the first bit received. Therefore, the 8051 transmit routine must take this requirement into account, and mirror the data as needed.

GUID-245BB605-B7D0-413D-ADE7-906334165907-low.gif Figure 9-1 DACx311 to 80C51/80l51 Interfaces