SLASEQ4A October   2018  – December 2018 DAC43608 , DAC53608

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Block Diagram
      2.      Programmable Window Comparator
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configurations and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements: I2CTM Standard Mode
    7. 7.7  Timing Requirements: I2CTM Fast Mode
    8. 7.8  Timing Requirements: I2CTM Fast+ Mode
    9. 7.9  Timing Requirements: Logic
    10. 7.10 Typical Characteristics: 1.8 V
    11. 7.11 Typical Characteristics: 5.5 V
    12. 7.12 Typical Characteristics
    13. 7.13 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Digital-to-Analog Converter (DAC) Architecture
        1. 8.3.1.1 DAC Transfer Function
        2. 8.3.1.2 DAC Register Update and LDAC Functionality
        3. 8.3.1.3 CLR Functionality
        4. 8.3.1.4 Output Amplifier
      2. 8.3.2 Reference
      3. 8.3.3 Power-on-Reset (POR)
      4. 8.3.4 Software Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Mode
    5. 8.5 Programming
      1. 8.5.1 F/S Mode Protocol
      2. 8.5.2 DACx3608 I2CTM Update Sequence
      3. 8.5.3 DACx3608 Address Byte
      4. 8.5.4 DACx3608 Command Byte
      5. 8.5.5 DACx3608 Data Byte (MSDB and LSDB)
      6. 8.5.6 DACx3608 I2CTM Read Sequence
    6. 8.6 Register Map
      1. 8.6.1 DEVICE_CONFIG Register (offset = 01h) [reset = 00FFh]
        1. Table 10. DEVICE_CONFIG Register Field Descriptions
      2. 8.6.2 STATUS/TRIGGER Register (offset = 02h) [reset = 0300h for DAC53608, reset = 0500h for DAC43608]
        1. Table 11. STATUS/TRIGGER Register Field Descriptions
      3. 8.6.3 BRDCAST Register (offset = 03h) [reset = 0000h]
        1. Table 12. BRDCAST Register Field Descriptions
      4. 8.6.4 DACn_DATA Register (offset = 08h to 0Fh) [reset = 0000h]
        1. Table 13. DACn_DATA Register Field Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Programmable LED Biasing
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Programmable Window Comparator
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.7 Timing Requirements: I2CTM Fast Mode

all input signals are timed from VIL to 70% of VDD, 1.8 V ≤ VDD ≤ 5.5 V, 1.8 V ≤ VREFIN ≤ VDD, –40°C ≤ TA ≤ +125°C, Vpull up = VDD for 1.8 V ≤ VDD ≤ 2.7 V, Vpull up = 2.7 V or VDD for 2.7 V ≤ VDD ≤ 5.5 V
MIN NOM MAX UNIT
fSCLK SCLK frequency 0.4 MHz
tBUF Bus free time between stop and start conditions 1.3 µs
tHDSTA Hold time after repeated start 0.6 µs
tSUSTA Repeated start setup time 0.6 µs
tSUSTO Stop condition setup time 0.6 µs
tHDDAT Data hold time 0 ns
tSUDAT Data setup time 100 ns
tLOW SCL clock low period 1300 ns
tHIGH SCL clock high period 600 ns
tF Clock and data fall time 300 ns
tR Clock and data rise time 300 ns