SLASF61A January   2023  – September 2023 DAC539G2-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Voltage Output
    6. 6.6  Electrical Characteristics: Comparator Mode
    7. 6.7  Electrical Characteristics: General
    8. 6.8  Timing Requirements: I2C Standard Mode
    9. 6.9  Timing Requirements: I2C Fast Mode
    10. 6.10 Timing Requirements: I2C Fast Mode Plus
    11. 6.11 Timing Requirements: SPI Write Operation
    12. 6.12 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 0)
    13. 6.13 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 1)
    14. 6.14 Timing Requirements: GPIO
    15. 6.15 Timing Diagrams
    16. 6.16 Typical Characteristics: Voltage Output
    17. 6.17 Typical Characteristics: Comparator
    18. 6.18 Typical Characteristics: General
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Smart Digital-to-Analog Converter (DAC) Architecture
      2. 7.3.2 Programming Interface
      3. 7.3.3 Nonvolatile Memory (NVM)
    4. 7.4 Device Functional Modes
      1. 7.4.1 GPI-to-Voltage Converter
        1. 7.4.1.1 Voltage Reference and DAC Transfer Function
        2. 7.4.1.2 Power-Supply as Reference
        3. 7.4.1.3 Internal Reference
        4. 7.4.1.4 External Reference
      2. 7.4.2 Voltage-to-PWM Converter
        1. 7.4.2.1 Function Generation
          1. 7.4.2.1.1 Triangular Waveform Generation
          2. 7.4.2.1.2 Sawtooth Waveform Generation
          3. 7.4.2.1.3 PWM Frequency Correction
      3. 7.4.3 Device Reset and Fault Management
        1. 7.4.3.1 Power-On Reset (POR)
        2. 7.4.3.2 External Reset
        3. 7.4.3.3 Register-Map Lock
        4. 7.4.3.4 NVM Cyclic Redundancy Check (CRC)
          1. 7.4.3.4.1 NVM-CRC-FAIL-USER Bit
          2. 7.4.3.4.2 NVM-CRC-FAIL-INT Bit
      4. 7.4.4 Power-Down Mode
    5. 7.5 Programming
      1. 7.5.1 SPI Programming Mode
      2. 7.5.2 I2C Programming Mode
        1. 7.5.2.1 F/S Mode Protocol
        2. 7.5.2.2 I2C Update Sequence
          1. 7.5.2.2.1 Address Byte
          2. 7.5.2.2.2 Command Byte
        3. 7.5.2.3 I2C Read Sequence
    6. 7.6 Register Maps
      1. 7.6.1  NOP Register (address = 00h) [reset = 0000h]
      2. 7.6.2  DAC-X-VOUT-CMP-CONFIG Register (address = 15h, 03h) [reset = 0400h]
      3. 7.6.3  COMMON-CONFIG Register (address = 1Fh) [reset = 03F9h]
      4. 7.6.4  COMMON-TRIGGER Register (address = 20h) [reset = 0000h]
      5. 7.6.5  FUNCTION-TRIGGER Register (address = 21h) [reset = 0001h]
      6. 7.6.6  GENERAL-STATUS Register (address = 22h) [reset = 2068h]
      7. 7.6.7  DEVICE-MODE-CONFIG Register (address = 25h) [reset = 8040h]
      8. 7.6.8  INTERFACE-CONFIG Register (address = 26h) [reset = 0000h]
      9. 7.6.9  STATE-MACHINE-CONFIG Register (address = 27h) [reset = 0003h]
      10. 7.6.10 SRAM-CONFIG Register (address = 2Bh) [reset = 0000h]
      11. 7.6.11 SRAM-DATA Register (address = 2Ch) [reset = 0000h]
      12. 7.6.12 FUNCTION-CONFIG Register (SRAM address = 20h) [reset = 007Ah]
      13. 7.6.13 FUNCTION-MAX Register (SRAM address = 21h) [reset = B900h]
      14. 7.6.14 FUNCTION-MIN Register (SRAM address = 22h) [reset = 1900h]
      15. 7.6.15 GPI-DEBOUNCE Register (SRAM address = 23h) [reset = 0138h]
      16. 7.6.16 VOUT-DATA-X Register (SRAM address = 24h to 2Bh) [reset = see #GUID-D64978E3-E8F0-4408-A2C1-8C72D24777EC/X6961 ]
      17. 7.6.17 PWM-FREQUENCY-ERROR Register (SRAM address = 9Eh) [reset = device-specific]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.2 Voltage-to-PWM Converter

Chanel 0 functions as the voltage-to-PWM converter. Channel 1 can also be used as a comparator, if needed after the application is stopped using the STATE_MACHINE-CONFIG register. To enter the comparator mode for a channel, write 1 to the CMP-X-EN and the CMP-X-OUT-EN bits in the respective DAC-X-VOUT-CMP-CONFIG register. The comparator output can be configured as push-pull or open-drain using the CMP-X-OD-EN bit. To invert the comparator output, write 1 to the CMP-X-INV-EN bit. The FBx pin has a finite impedance. To enable high-impedance on the FBx pin, write 1 to the CMP-X-HIZ-IN-DIS bit.

Note: In the Hi-Z input mode, the comparator input range is limited to:
  • For GAIN = 1 ×, 1.5 ×, or 2 ×: VFB ≤ (VREF × GAIN) / 3
  • For GAIN = 3 ×, or 4 ×: VFB ≤ (VREF × GAIN) / 6
Any higher input voltage is clipped.