SLASF61A January   2023  – September 2023 DAC539G2-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Voltage Output
    6. 6.6  Electrical Characteristics: Comparator Mode
    7. 6.7  Electrical Characteristics: General
    8. 6.8  Timing Requirements: I2C Standard Mode
    9. 6.9  Timing Requirements: I2C Fast Mode
    10. 6.10 Timing Requirements: I2C Fast Mode Plus
    11. 6.11 Timing Requirements: SPI Write Operation
    12. 6.12 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 0)
    13. 6.13 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 1)
    14. 6.14 Timing Requirements: GPIO
    15. 6.15 Timing Diagrams
    16. 6.16 Typical Characteristics: Voltage Output
    17. 6.17 Typical Characteristics: Comparator
    18. 6.18 Typical Characteristics: General
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Smart Digital-to-Analog Converter (DAC) Architecture
      2. 7.3.2 Programming Interface
      3. 7.3.3 Nonvolatile Memory (NVM)
    4. 7.4 Device Functional Modes
      1. 7.4.1 GPI-to-Voltage Converter
        1. 7.4.1.1 Voltage Reference and DAC Transfer Function
        2. 7.4.1.2 Power-Supply as Reference
        3. 7.4.1.3 Internal Reference
        4. 7.4.1.4 External Reference
      2. 7.4.2 Voltage-to-PWM Converter
        1. 7.4.2.1 Function Generation
          1. 7.4.2.1.1 Triangular Waveform Generation
          2. 7.4.2.1.2 Sawtooth Waveform Generation
          3. 7.4.2.1.3 PWM Frequency Correction
      3. 7.4.3 Device Reset and Fault Management
        1. 7.4.3.1 Power-On Reset (POR)
        2. 7.4.3.2 External Reset
        3. 7.4.3.3 Register-Map Lock
        4. 7.4.3.4 NVM Cyclic Redundancy Check (CRC)
          1. 7.4.3.4.1 NVM-CRC-FAIL-USER Bit
          2. 7.4.3.4.2 NVM-CRC-FAIL-INT Bit
      4. 7.4.4 Power-Down Mode
    5. 7.5 Programming
      1. 7.5.1 SPI Programming Mode
      2. 7.5.2 I2C Programming Mode
        1. 7.5.2.1 F/S Mode Protocol
        2. 7.5.2.2 I2C Update Sequence
          1. 7.5.2.2.1 Address Byte
          2. 7.5.2.2.2 Command Byte
        3. 7.5.2.3 I2C Read Sequence
    6. 7.6 Register Maps
      1. 7.6.1  NOP Register (address = 00h) [reset = 0000h]
      2. 7.6.2  DAC-X-VOUT-CMP-CONFIG Register (address = 15h, 03h) [reset = 0400h]
      3. 7.6.3  COMMON-CONFIG Register (address = 1Fh) [reset = 03F9h]
      4. 7.6.4  COMMON-TRIGGER Register (address = 20h) [reset = 0000h]
      5. 7.6.5  FUNCTION-TRIGGER Register (address = 21h) [reset = 0001h]
      6. 7.6.6  GENERAL-STATUS Register (address = 22h) [reset = 2068h]
      7. 7.6.7  DEVICE-MODE-CONFIG Register (address = 25h) [reset = 8040h]
      8. 7.6.8  INTERFACE-CONFIG Register (address = 26h) [reset = 0000h]
      9. 7.6.9  STATE-MACHINE-CONFIG Register (address = 27h) [reset = 0003h]
      10. 7.6.10 SRAM-CONFIG Register (address = 2Bh) [reset = 0000h]
      11. 7.6.11 SRAM-DATA Register (address = 2Ch) [reset = 0000h]
      12. 7.6.12 FUNCTION-CONFIG Register (SRAM address = 20h) [reset = 007Ah]
      13. 7.6.13 FUNCTION-MAX Register (SRAM address = 21h) [reset = B900h]
      14. 7.6.14 FUNCTION-MIN Register (SRAM address = 22h) [reset = 1900h]
      15. 7.6.15 GPI-DEBOUNCE Register (SRAM address = 23h) [reset = 0138h]
      16. 7.6.16 VOUT-DATA-X Register (SRAM address = 24h to 2Bh) [reset = see #GUID-D64978E3-E8F0-4408-A2C1-8C72D24777EC/X6961 ]
      17. 7.6.17 PWM-FREQUENCY-ERROR Register (SRAM address = 9Eh) [reset = device-specific]
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Electrical Characteristics: Comparator Mode

minimum and maximum specifications at TA = –40°C to +125°C and typical specifications at TA = 25°C, 1.7 V ≤ VDD ≤ 5.5 V, DAC reference tied to VDD, gain = 1 × in voltage output mode, DAC output pin (OUT) loaded with resistive load (RL = 5 kΩ to AGND) and capacitive load (CL = 200 pF to AGND), and digital inputs at VDD or AGND (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
STATIC PERFORMANCE
Offset error(1) (2) 1.7 V ≤ VDD ≤ 5.5 V; DAC at midscale, comparator input at Hi-Z, and DAC operating with external reference –7.5 0 7.5 mV
Offset error time drift(1) VDD = 5.5 V, TA = 125°C, FB in Hi-Z mode, DAC at full scale and VFB at 0 V or DAC at zero scale and VFB at 1.84 V, drift specified for 10 years of continuous operation 4 mV
OUTPUT
Input voltage VREF connected to VDD, VFB resistor network connected to ground 0 VDD V
VREF connected to VDD, VFB resistor network disconnected from ground 0 VDD (1/3 – 1/100)
VOL Logic low output voltage ILOAD = 100 μA, output in open-drain mode 0.1 V
DYNAMIC PERFORMANCE
tresp Output response time DAC at midscale with 10-bit resolution, FB input at Hi-Z, and transition step at FB node is (VDAC – 2 LSB) to (VDAC + 2 LSB), transition time measured between 10% and 90% of output, output current of 100 µA, comparator output configured in push-pull mode, load capacitor at DAC output is 25 pF 10 µs
(1) Specified by design and characterization, not production tested.
(2) This specification does not include the total unadjusted error (TUE) of the DAC.