SLAS452E October   2020  – January 2021 DAC5652

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Rationgs
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Resistance Characteristics
    5. 6.5  Electrical Characteristics
    6. 6.6  Electrical Characteristics
    7. 6.7  Electrical Characteristics, AC
    8. 6.8  Electrical Characteristics, DC
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Digital Inputs and Timing
      1. 7.1.1 Digital Inputs
      2. 7.1.2 Input Interfaces
      3. 7.1.3 Dual-Bus Data Interface and Timing
      4. 7.1.4 Single-Bus Interleaved Data Interface and Timing
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DAC Transfer Function
      2. 8.3.2 Analog Outputs
      3. 8.3.3 Output Configurations
      4. 8.3.4 Differential With Transformer
      5. 8.3.5 Single-Ended Configuration
      6. 8.3.6 Reference Operation
        1. 8.3.6.1 Internal Reference
        2. 8.3.6.2 External Reference
      7. 8.3.7 Gain Setting Option
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode
  9. 9 Application Information Disclaimer
    1. 9.1 Application Informmation
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Performance Plots
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Resistance Characteristics

THERMAL METRIC(1) DAC5652 UNIT
TQFP (PFB)
48-Pins
R θJA Junction-to-ambient thermal resistance 65.3 °C/W
R θJC(top) Junction-to-case (top) thermal resistance 16.4 °C/W
R θJB Junction-to-board thermal resistance 28.6 °C/W
ψ JT Junction-to-top characterization parameter 0.4 °C/W
ψ JB Junction-to-board characterization parameter 28.4 °C/W
R θJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.