SLAS535F September   2007  – October 2018 DAC5652A

PRODUCTION DATA.  

  1. Features
  2. Applications
    1.     Functional Block Diagram
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: DC
    6. 6.6  Electrical Characteristics: AC
    7. 6.7  Electrical Characteristics: Digital Input
    8. 6.8  Electrical Characteristics: Power Supply
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Inputs
      2. 7.3.2 References
        1. 7.3.2.1 Internal Reference
        2. 7.3.2.2 External Reference
    4. 7.4 Device Functional Modes
      1. 7.4.1 Input Interfaces
        1. 7.4.1.1 Dual-Bus Data Interface and Timing
        2. 7.4.1.2 Single-Bus Interleaved Data Interface and Timing
      2. 7.4.2 Gain Setting Option
      3. 7.4.3 Sleep Mode
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 DAC Transfer Function
        1. 8.1.1.1 Analog Outputs
      2. 8.1.2 Output Configurations
      3. 8.1.3 Differential With Transformer
      4. 8.1.4 Single-Ended Configuration
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

Use the DAC5652AEVM layout as a reference to obtain the best performance. A sample layout is shown in Figure 23 through Figure 26. Some important layout recommendations are:

  1. Use a single ground plane. Keep the digital and analog signals on distinct separate sections of the board. This may be virtually divided down the middle of the device package when doing placement and layout.
  2. Keep the analog outputs as far away from the switching clocks and digital signals as possible. This keeps coupling from the digital circuits to the analog outputs to a minimum.
  3. Keep decoupling capacitors close to the power pins of the device.