SLAS425D July   2004  – October 2021 DAC5662

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configurations and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Resistance Characteristics
    5. 6.5  Electrical Characteristics
    6. 6.6  Electrical Characteristics
    7. 6.7  Electrical Characteristics, AC
    8. 6.8  Electrical Characteristics, DC
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Digital Inputs and Timing
      1. 7.1.1 Digital Inputs
      2. 7.1.2 Input Interfaces
      3. 7.1.3 Dual-Bus Data Interface and Timing
      4. 7.1.4 Single-Bus Interleaved Data Interface and Timing
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DAC Transfer Function
        1. 8.3.1.1 Analog Outputs
      2. 8.3.2 Output Configurations
      3. 8.3.3 Differential With Transformer
      4. 8.3.4 Single-Ended Configuration
      5. 8.3.5 Reference Operation
        1. 8.3.5.1 Internal Reference
        2. 8.3.5.2 External Reference
      6. 8.3.6 Gain Setting Option
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode
  9. 9 Application and Implementation
    1. 9.1 Application Informmation
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PFB|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Layout Guidelines

The DAC5662 EVM layout should be used as a reference for the layout to obtain the best performance. A sample layout is shown in Figure 11-1 through Figure 11-4. Some important layout recommendations are:

  1. Use a single ground plane. Keep the digital and analog signals on distinct separate sections of the board. This may be virtually divided down the middle of the device package when doing placement and layout.
  2. Keep the analog outputs as far away from the switching clocks and digital signals as possible. This will keep coupling from the digital circuits to the analog outputs to a minimum.
  3. Decoupling caps should be kept close to the power pins of the device.