SBAS334D November   2004  – July 2016 DAC5675A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description Continued
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 DC Electrical Characteristics
    6. 7.6 AC Electrical Characteristics
    7. 7.7 Digital Specifications
    8. 7.8 Operational Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Digital Inputs
      2. 8.3.2 Clock Input
      3. 8.3.3 Supply Inputs
      4. 8.3.4 DAC Transfer Function
      5. 8.3.5 Reference Operation
      6. 8.3.6 Analog Current Outputs
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
    6. 12.6 Device Nomenclature
      1. 12.6.1 Definitions of Specifications and Terminology
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates — go to the product folder for your device on ti.com. In the upper right-hand corner, click the Alert me button to register and receive a weekly digest of product information that has changed (if any). For change details, check the revision history of any revised document.

12.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.3 Trademarks

PowerPad, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12.6 Device Nomenclature

12.6.1 Definitions of Specifications and Terminology

Gain error is defined as the percentage error in the ratio between the measured full-scale output current and the value of 16 x V(EXTIO)/RBIAS. A V(EXTIO) of 1.25V is used to measure the gain error with an external reference voltage applied. With an internal reference, this error includes the deviation of V(EXTIO) (internal bandgap reference voltage) from the typical value of 1.25V.

Offset error is defined as the percentage error in the ratio of the differential output current (IOUT1–IOUT2) and the half of the full-scale output current for input code 8192.

THD is the ratio of the rms sum of the first six harmonic components to the rms value of the fundamental output signal.

SNR is the ratio of the rms value of the fundamental output signal to the rms sum of all other spectral components below the Nyquist frequency, including noise, but excluding the first six harmonics and dc.

SINAD is the ratio of the rms value of the fundamental output signal to the rms sum of all other spectral components below the Nyquist frequency, including noise and harmonics, but excluding dc.

ACPR or adjacent channel power ratio is defined for a 3.84Mcps 3GPP W-CDMA input signal measured in a 3.84MHz bandwidth at a 5MHz offset from the carrier with a 12dB peak-to-average ratio.

APSSR or analog power supply ratio is the percentage variation of full-scale output current versus a 5% variation of the analog power supply AVDD from the nominal. This is a dc measurement.

DPSSR or digital power supply ratio is the percentage variation of full-scale output current versus a 5% variation of the digital power supply DVDD from the nominal. This is a dc measurement.