SLLS853F August   2007  – January 2015 DAC5682Z

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics — DC Specification
    6. 7.6 Electrical Characteristics — AC Specification
    7. 7.7 Electrical Characteristics (Digital Specifications)
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  FIR Filters
      2. 8.3.2  Coarse Mixers: CMIX0 and CMIX1
      3. 8.3.3  Clock Inputs
      4. 8.3.4  LVDS Data Interfacing
      5. 8.3.5  LVDS Inputs
      6. 8.3.6  LVDS SYNCP/N Operation
      7. 8.3.7  DLL Operation
      8. 8.3.8  CMOS Digital Inputs
      9. 8.3.9  Reference Operation
      10. 8.3.10 DAC Transfer Function
      11. 8.3.11 DAC Output SINC Response
      12. 8.3.12 Analog Current Outputs
      13. 8.3.13 Designing the PLL Loop Filter
      14. 8.3.14 Test Methodology
    4. 8.4 Device Functional Modes
      1. 8.4.1 Dual-Channel Real Upconversion
      2. 8.4.2 Clock and Data Modes
      3. 8.4.3 PLL Clock Mode
      4. 8.4.4 Recommended Multi-DAC Synchronization Procedure Multi-DAC Synchronization Procedure
      5. 8.4.5 Digital Self Test Mode
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
    6. 8.6 Register Maps
      1. 8.6.1  Register Name: STATUS0 - Address: 0x00, Default = 0x03
      2. 8.6.2  Register Name: CONFIG1 - Address: 0x01, Default = 0x10
      3. 8.6.3  Register Name: CONFIG2 - Address: 0x02, Default = 0xC0
      4. 8.6.4  Register Name: CONFIG3 - Address: 0x03, Default = 0x70
      5. 8.6.5  Register Name: STATUS4 - Address: 0x04, Default = 0x00
      6. 8.6.6  Register Name: CONFIG5 - Address: 0x05, Default = 0x00
      7. 8.6.7  Register Name: CONFIG6 - Address: 0x06, Default = 0x0C
      8. 8.6.8  Register Name: CONFIG7 - Address: 0x07, Default = 0xFF
      9. 8.6.9  Register Name: CONFIG8 - Address: 0x08, Default = 0x00
      10. 8.6.10 Register Name: CONFIG9 - Address: 0x09, Default = 0x00
      11. 8.6.11 Register Name: CONFIG10 - Address: 0x0A, Default = 0x00
      12. 8.6.12 Register Name: CONFIG11 - Address: 0x0B, Default = 0x00
      13. 8.6.13 Register Name: CONFIG12 - Address: 0x0C, Default = 0x00
      14. 8.6.14 Register Name: CONFIG13 - Address: 0x0D, Default = 0x00
      15. 8.6.15 Register Name: CONFIG14 - Address: 0x0E, Default = 0x00
      16. 8.6.16 Register Name: CONFIG15 - Address: 0x0F, Default = 0x00
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Digital Interface and Clocking Considerations for Application Examples
      2. 9.3.2 Single Complex Input, Real IF Output Radio
      3. 9.3.3 Dual Channel Real IF Output Radio
      4. 9.3.4 Direct Conversion Radio
      5. 9.3.5 CMTS/VOD Transmitter
      6. 9.3.6 High-Speed Arbitrary Waveform Generator
    4. 9.4 Initialization Set Up
      1. 9.4.1 Recommended Start-up Sequence
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Device Nomenclature
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGC|64
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Supply voltage DVDD(2) –0.5 2.3 V
VFUSE(2) –0.5 2.3 V
CLKVDD(2) –0.5 2.3 V
AVDD(2) –0.5 4 V
IOVDD(2) –0.5 4 V
Supply voltage AVDD to DVDD –2 2.6 V
CLKVDD to DVDD –0.5 0.5 V
IOVDD to AVDD –0.5 0.5 V
D[15..0]P ,D[15..0]N, SYNCP, SYNCN (2) –0.5 DVDD + 0.5 V
DCLKP, DCLKN(2) –0.3 2.1 V
CLKIN, CLKINC(2) –0.5 CLKVDD + 0.5 V
SDO, SDIO, SCLK, SDENB, RESETB (2) –0.5 IOVDD + 0.5 V
IOUTA1/B1, IOUTA2/B2 (2) –0.5 AVDD + 0.5 V
LPF, EXTIO, EXTLO, BIASJ(2) –0.5 AVDD + 0.5 V
Peak input current (any input) 20 mA
Peak total input current (all inputs) –30 mA
Operating free-air temperature, TA: DAC5682Z –40 85 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Measured with respect to GND.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
SUPPLIES
AVDD 3 3.3 3.6 V
DVDD 1.7 1.8 1.9 V
CLKVDD 1.7 1.8 1.9 V
IOVDD 3 3.3 3.6 V
ANALOG OUTPUT
IOUTA1, IOUTA2, IOUTB1, IOUTB2 0 20 20 mA
V IOUTA1, IOUTA2, IOUTB1, IOUTB2 Compliance voltage AVDD-0.5 AVDD+0.5 V
CLOCK INPUT
CLKIN ECL/PECL Frequency 1000 MHz
CLKIN Amplitude Differential 0.4 1 CLKVDD V
CLKIN Duty Cycle 50%
CLKIN common mode voltage CLKDVDD/2 V
DCLK LVDS Frequency 500 MHz
DIGITAL INPUTS
SYNC LVDS 1 1.2 1.4 V
D15..D0 LVDS 1 1.2 1.4 V
LVDS Common mode 1.2 V
LVDS Differential Swing 0.4 V
SCLK, SDIO, SDENB, SDO CMOS SPI GND IOVDD V

7.4 Thermal Information

THERMAL METRIC(1) DAC5682Z UNIT
QFN
64 PINS
TJ Maximum junction temperature (2) 125 °C
RθJA Theta junction-to-ambient (still air) 22 °C/W
Theta junction-to-ambient (150 lfm) 16
RθJC Theta junction-to-case 0.2 °C/W
RθJP Theta junction-to-pad 3.5 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) Air flow or heat sinking reduces θJA and may be required for sustained operation at 85° under maximum operating conditions.

7.5 Electrical Characteristics — DC Specification

over operating free-air temperature range , AVDD = 3.3 V, CLKVDD = 1.8 V, IOVDD = 3.3 V, DVDD = 1.8 V, IoutFS = 20 mA (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Resolution 16 Bits
DC ACCURACY(1)
INL Integral nonlinearity 1 LSB = IOUTFS/216 ±4 LSB
DNL Differential nonlinearity ±2
ANALOG OUTPUT
Course gain linearity ±0.04 LSB
Offset error Mid code offset 0.01 %FSR
Gain error With external reference 1 %FSR
Gain error With internal reference 0.7 %FSR
Gain mismatch With internal reference, dual DAC –2 2 %FSR
Minimum full scale output current(2) 2 mA
Maximum full scale output current(2) 20
Output Compliance range(3) IOUTFS = 20 mA AVDD
–0.5V		 AVDD
+ 0.5V		 V
Output resistance 300 kΩ
Output capacitance 5 pF
REFERENCE OUTPUT
Vref Reference voltage 1.14 1.2 1.26 V
Reference output current(4) 100 nA
REFERENCE INPUT
VEXTIO Input voltage range 0.1 1.25 V
Input resistance 1 MΩ
Small signal bandwidth CONFIG6: BiasLPF_A and BiasLPF_B = 0 95 kHz
CONFIG6: BiasLPF_A and BiasLPF_B = 1 472
Input capacitance 100 pF
TEMPERATURE COEFFICIENTS
Offset drift ±1 ppm of FSR/°C
Gain drift With external reference ±15 ppm of FSR/°C
With internal reference ±30
Reference voltage drift ±8 ppm/°C
POWER SUPPLY
Analog supply voltage, AVDD 3.0 3.3 3.6 V
Digital supply voltage, DVDD 1.7 1.8 1.9 V
Clock supply voltage, CLKVDD 1.7 1.8 1.9 V
I/O supply voltage, IOVDD 3.0 3.3 3.6 V
I(AVDD) Analog supply current Mode 4 (below) 133 mA
I(DVDD) Digital supply current 455 mA
I(CLKVDD) Clock supply current 45 mA
I(IOVDD) IO supply current 12 mA
I(AVDD) Sleep mode, AVDD supply current Mode 6 (below) 1.0 mA
I(DVDD) Sleep mode, DVDD supply current 1.5 mA
I(CLKVDD) Sleep mode, CLKVDD supply current 2.5 mA
I(IOVDD) Sleep mode, IOVDD supply current 2.0 mA
P AVDD + IOVDD current, 3.3 V Mode 1: 2X2, PLL = OFF, CLKIN = 983.04 MHz
FDAC = 983.04 MHz, IF = 184.32 MHz
DACA and DACB ON, 4 carrier WCDMA		 135 mA
DVDD + CLKVDD current, 1.8 V 450 mA
Power Dissipation 1255 mW
AVDD + IOVDD current, 3.3 V Mode 2: 2X2, PLL = ON (8X), CLKIN = 122.88 MHz
FDAC = 983.04 MHz, IF = 184.32 MHz
DACA and DACB ON, 4 carrier WCDMA		 145 mA
DVDD + CLKVDD current, 1.8 V 485 mA
Power Dissipation 1350 mW
AVDD + IOVDD current, 3.3 V Mode 3: 2X4, CMIX0 = Fs/4, PLL = OFF, CLKIN = 983.04 MHz
FDAC = 983.04 MHz, IF = 215.04 MHz
DACA and DACB ON, 4 carrier WCDMA		 135 mA
DVDD + CLKVDD current, 1.8 V 480 mA
Power Dissipation 1310 mW
AVDD + IOVDD current, 3.3 V Mode 4: 2X4, CMIX0 = Fs/4, PLL = ON (8X), CLKIN = 122.88 MHz
FDAC = 983.04 MHz, IF = 215.04 MHz
DACA and DACB ON, 4 carrier WCDMA		 145 mA
DVDD + CLKVDD current, 1.8 V 505 mA
Power Dissipation 1400 1600 mW
AVDD + IOVDD current, 3.3 V Mode 5: 2X2, CMIX0 = Fs/4, PLL = OFF, CLKIN = 983.04 MHz
FDAC = 983.04 MHz, Digital Logic Disabled
DACA and DACB SLEEP, Static Data Pattern		 5 mA
DVDD + CLKVDD current, 1.8 V 185 mA
Power Dissipation 350 mW
AVDD + IOVDD current, 3.3 V Mode 6: 2X4, PLL = OFF, CLKIN = OFF
FDAC = OFF, Digital Logic Disabled
DACA and DACB = SLEEP, Static Data Pattern		 3.0 mA
DVDD + CLKVDD current, 1.8 V 4.0 mA
Power Dissipation 17.0 30.0 mW
PSRR Power supply rejection ratio DC tested –0.2 0.2 %FSR/V
T Operating range –40 85 °C
(1) Measured differential across IOUTA1 and IOUTA2 or IOUTB1 and IOUTB2 with 25 Ω each to AVDD.
(2) Nominal full-scale current, IoutFS, equals 16 × IBIAS current.
(3) The lower limit of the output compliance is determined by the CMOS process. Exceeding this limit may result in transistor breakdown, resulting in reduced reliability of the DAC5682Z device. The upper limit of the output compliance is determined by the load resistors and full-scale output current. Exceeding the upper limit adversely affects distortion performance and integral nonlinearity.
(4) Use an external buffer amplifier with high impedance input to drive any external load.

7.6 Electrical Characteristics — AC Specification(1)

Over recommended operating free-air temperature range, AVDD, IOVDD = 3.3 V, CLKVDD, DVDD = 1.8 V, IOUTFS = 20 mA, 4:1 transformer output termination, 50Ω doubly terminated load (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ANALOG OUTPUT
fCLK Maximum output update rate 1000 MSPS
ts(DAC) Output settling time to 0.1% Transition: Code 0x0000 to 0xFFFF 10.4 ns
tpd Output propagation delay 2.5 ns
tr(IOUT) Output rise time 10% to 90% 220 ps
tf(IOUT) Output fall time 90% to 10% 220 ps
Digital latency No interpolation, PLL Off 78 DAC clock cycles
x2 interpolation, PLL Off 163
x4 interpolation, PLL Off 308
Power-up time DAC wake-up time IOUT current settling to 1% of IOUTFS.
Measured from SDENB; Register 0x06, toggle Bit 4 from 1 to 0.		 80 μs
DAC sleep time IOUT current settling to 1% of IOUTFS.
Measured from SDENB; Register 0x06, toggle Bit 4 from 0 to 1.		 80
AC PERFORMANCE
SFDR Spurious free dynamic range 1X1, PLL off, CLKIN = 500 MHz, DACA on, IF = 5.1 MHz,
First Nyquist Zone < fDATA/2		 81 dBc
2X2, PLL off, CLKIN = 1000 MHz, DACA and DACB on,
IF = 5.1 MHz, First Nyquist Zone < fDATA/2		 80
2X2, PLL off, CLKIN = 1000 MHz, DACA and DACB on,
IF = 20.1 MHz, First Nyquist Zone < fDATA/2		 77
SNR Signal-to-noise ratio 2X2, PLL off, CLKIN = 500 MHZ, DACA and DACB on, Single tone, 0 dBFS, IF = 20.1 MHz 75 dBc
2X2, PLL off, CLKIN = 1000 MHZ, DACA and DACB on, Single tone, 0 dBFS, IF = 20.1 MHz 70
2X2, PLL off, CLKIN = 1000 MHZ, DACA and DACB on, Single tone, 0 dBFS, IF = 70.1 MHz 66
2X4, PLL off, CLKIN = 1000 MHZ, DACA and DACB on, Single tone, 0 dBFS, IF = 180 MHz 60
2X2 CMIX, PLL off, CLKIN = 1000 MHZ, DACA and DACB on, Single tone, 0 dBFS, IF = 300.2 MHz 60
2X2, PLL off, CLKIN = 1000 MHZ, DACA and DACB on, Four tone, each -12 dBFS, IF = 24.7, 24.9, 25.1 and 25.3 MHz 73
IMD3 Third-order two-tone intermodulation
(each tone at –6 dBFS)		 2X2, PLL off, CLKIN = 1000 MHZ, DACA and DACB on,
IF = 20.1 and 21.1 MHz		 88 dBc
2X2, PLL off, CLKIN = 1000 MHZ, DACA and DACB on,
IF = 70.1 and 71.1 MHz		 75
2X2 CMIX, PLL off, CLKIN = 1000 MHZ, DACA and DACB on,
IF = 150.1 and 151.1 MHz		 67
IMD Four-tone intermodulation (each tone at –12 dBFS) 2X2 CMIX, PLL off, CLKIN = 1000 MHz, DACA and DACB on,
fOUT = 298.4, 299.2, 300.8 and 301.6 MHz		 64 dBc
ACLR(2) Adjacent channel leakage ratio Single carrier, baseband, 2X2, PLL off, CLKIN = 983.04 MHz, DACA and DACB on 80 83 dBc
Single carrier, IF = 180 MHz, 2X2, PLL off,
CLKIN = 983.04 MHz, DACA and DACB on		 73
Four carrier, IF = 180 MHz, 2X2 CMIX, PLL off,
CLKIN = 983.04 MHz, DACA and DACB on		 68
Four carrier, IF = 275 MHz, 2X2 CMIX, PLL off,
CLKIN = 983.04 MHz, DACA and DACB on		 66
Noise floor(3) 50-MHz offset, 1-MHz BW, Single Carrier, baseband, 2X2, PLL off, CLKIN = 983.04 93 dBc
50-MHz offset, 1-MHz BW, Four Carrier, baseband, 2X2, PLL off, CLKIN = 983.04. 85
(1) Measured single-ended into 50 Ω load.
(2) W-CDMA with 3.84 MHz BW, 5-MHz spacing, centered at IF. TESTMODEL 1, 10 ms
(3) Carrier power measured in 3.84 MHz BW.

7.7 Electrical Characteristics (Digital Specifications)

over recommended operating free-air temperature range, AVDD, IOVDD = 3.3 V, CLKVDD, DVDD = 1.8 V.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
LVDS INTERFACE: D[15:0]P/N, SYNCP/N, DCLKP/N(1)
VA,B+ Logic high differential input voltage threshold 175 mV
VA,B– Logic low differential input voltage threshold –175 mV
VCOM1 Input Common Mode SYNCP/N, D[15:0]P/N only 1.0 V
VCOM2 Input Common Mode DCLKP/N only DVDD
÷2		 V
ZT Internal termination SYNCP/N, D[15:0]P/N only 85 110 135 Ω
CL LVDS Input capacitance 2 pF
tS, tH DCLK to Data DCLKP/N: 0 to 125 MHz (see Figure 43) DLL Disabled, CONFIG5 DLL_bypass = 1, CONFIG10 = '00000000' Setup_min 1100 ps
Hold_min –600
tSKEW(A), tSKEW(B) DCLK to Data Skew(2)
DLL Enabled,
CONFIG5 DLL_bypass = 0,
DDR format		 DCLKP/N = 150 MHz Positive 1000 ps
Negative –1800
DCLKP/N = 200 MHz Positive 800
Negative –1300
DCLKP/N = 250 MHz Positive 600
Negative –1000
DCLKP/N = 300 MHz Positive 450
Negative –800
DCLKP/N = 350 MHz Positive 400
Negative –700
DCLKP/N = 400 MHz Positive 300
Negative –600
DCLKP/N = 450 MHz Positive 300
Negative –500
DCLKP/N = 500 MHz Positive 350
Negative –300
fDATA Input
data rate supported		 DLL Disabled, CONFIG5 DLL_bypass = 1, DDR format,
DCLKP frequency: <125 MHz		 250 MSPS
DLL Enabled, CONFIG5 DLL_bypass = 0, DDR format,
DCLKP frequency: 125 to 500 MHz		 250 1000
DLL Operating Frequency (DCLKP/N Frequency) DLL Enabled, CONFIG5
DLL_bypass = 0, DDR format		 CONFIG10 = '11001101' = 0xCD 125 150 MHz
CONFIG10 = '11001110' = 0xCE 150 175
CONFIG10 = '11001111' = 0xCF 175 200
CONFIG10 = '11001000' = 0xC8 200 325
CONFIG10 = '11000000' = 0xC0 325 500
CMOS INTERFACE: SDO, SDIO, SCLK, SDENB, RESETB
VIH High-level input voltage 2 3 V
VIL Low-level input voltage 0 0 0.8 V
IIH High-level input current ±20 μA
IIL Low-level input current ±20 μA
CI CMOS Input capacitance 5 pF
VOH SDO, SDIO Iload = –100 μA IOVDD
–0.2		 V
Iload = –2 mA 0.8
x IOVDD		 V
VOL SDO, SDIO Iload = 100 μA 0.2 V
Iload = 2 mA 0.5 V
ts(SDENB) Setup time, SDENB to rising edge of SCLK 20 ns
ts(SDIO) Setup time, SDIO valid to rising edge of SCLK 10 ns
th(SDIO) Hold time, SDIO valid to rising edge of SCLK 5 ns
t(SCLK) Period of SCLK 100 ns
t(SCLKH) High time of SCLK 40 ns
t(SCLKL) Low time of SCLK 40 ns
td(Data) Data output delay after falling edge of SCLK 10 ns
tRESET Minimum RESETB pulse width 25 ns
CLOCK INPUT (CLKIN/CLKINC)
Duty cycle 50%
Differential voltage(3) 0.4 1 V
CLKIN/CLKINC input common mode CLKVDD
÷2		 V
PHASE LOCKED LOOP
Phase noise DAC output at 600 kHz offset, 100 MHz, 0-dBFS tone,
2X4, fDATA = 250 MSPS, CLKIN/C = 250 MHz,
PLL_m = '00111', PLL_n = '001', VCO_div2 = 0,
PLL_range = '1111', PLL_gain = '00'		 –125 dBc/ Hz
DAC output at 6 MHz offset, 100 MHz, 0-dBFS tone,
2X4, fDATA = 250 MSPS, CLKIN/C = 250 MHz,
PLL_m = '00111', PLL_n = '001', VCO_div2 = 0,
PLL_range = '1111', PLL_gain = '00'		 –146
PLL/VCO Operating Frequency,
Typical VCO Gain		 PLL_gain = '00', PLL_range = '0000' (0) 160 290 MHz
220 MHz/V
PLL_gain = '01', PLL_range = '0001' (1) 290 460 MHz
300 MHz/V
PLL_gain = '01', PLL_range = '0010' (2) 400 520 MHz
260 MHz/V
PLL_gain = '01', PLL_range = '0011' (3) 480 570 MHz
240 MHz/V
PLL_gain = '01', PLL_range = '0100' (4) 560 620 MHz
210 MHz/V
PLL_gain = '10', PLL_range = '0101' (5) 620 740 MHz
270 MHz/V
PLL_gain = '10', PLL_range = '0110' (6) 690 780 MHz
250 MHz/V
PLL_gain = '10', PLL_range = '0111' (7) 740 820 MHz
240 MHz/V
PLL_gain = '10', PLL_range = '1000' (8) 790 850 MHz
220 MHz/V
PLL_gain = '10', PLL_range = '1001' (9) 840 880 MHz
210 MHz/V
PLL_gain = '11', PLL_range = '1010' (A) 880 940 MHz
250 MHz/V
PLL_gain = '11', PLL_range = '1011' (B) 920 990 MHz
230 MHz/V
PLL_gain = '11', PLL_range = '1100' (C) 960 1000 MHz
220 MHz/V
PFD Maximum Frequency 160 MHz
(1) See LVDS Inputs for terminology.
(2) Positive skew: Clock ahead of data.
Negative skew: Data ahead of clock.
(3) Driving the clock input with a differential voltage lower than 1V will result in degraded performance.

7.8 Typical Characteristics

inl_1code1b_lls853.gifFigure 1. Integral Nonlinearity
pwr_frq1b_lls853.gifFigure 3. Single-Tone Spectral Plot
pwr_frq3b_lls853.gifFigure 5. Single-Tone Spectral Plot
sfdr_if2b_lls853.gifFigure 7. Out-Of-Band SFDR vs IF
imd_amp_lls853.gifFigure 9. Two-Tone IMD vs Amplitude
pwr_frq5b_lls853.gifFigure 11. Two-Tone IMD Spectral Plot
pwr_frq6b_lls853.gifFigure 13. Single-Carrier W-CDMA Test Model 1
pwr_frq8b_lls853.gifFigure 15. Single-Carrier W-CDMA Test Model 1
pwr_frq10b_lls853.gifFigure 17. Single-Carrier W-CDMA Test Model 1
pwr_frq12b_lls853.gifFigure 19. Two-Carrier W-CDMA Test Model 1
pwr_frq15b_lls853.gifFigure 21. Four-Carrier W-CDMA Test Model 1
pwr_frq17b_lls853.gifFigure 23. Three-Carrier W-CDMA Test Model 1 With Gap
dnl_1code2b_lls853.gifFigure 2. Differential Nonlinearity
pwr_frq2b_lls853.gifFigure 4. Single-Tone Spectral Plot
sfdr_if4_lls853.gifFigure 6. In-Band SFDR vs IF
aclr_ifb_lls853.gifFigure 8. Two-Tone IMD vs Output Frequency
pwr_frq4b_lls853.gifFigure 10. Two-Tone IMD Spectral Plot
aclr_freq_lls853.gifFigure 12. Single-Carrier W-CDMA Test Model 1
pwr_frq7b_lls853.gifFigure 14. Single-Carrier W-CDMA Test Model 1
pwr_frq9b_lls853.gifFigure 16. Single-Carrier W-CDMA Test Model 1
pwr_frq11b_lls853.gifFigure 18. Single-Carrier W-CDMA Test Model 1
pwr_frq13b_lls853.gifFigure 20. Two-Carrier W-CDMA Test Model 1
pwr_frq16b_lls853.gifFigure 22. Three-Carrier W-CDMA Test Model 1 With Gap