SLASED6D April   2016  – December 2017 DAC60004 , DAC70004 , DAC80004

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 DACx0004 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Output Amplifier
      2. 8.3.2 Reference Buffer
      3. 8.3.3 Power-On Reset
        1. 8.3.3.1 POR Pin Feature
        2. 8.3.3.2 Internal Power-On Reset (IPOR) Levels
    4. 8.4 Device Functional Modes
      1. 8.4.1 Serial Interface
        1. 8.4.1.1 Stand-Alone Mode
          1. 8.4.1.1.1 SYNC Interrupt - Stand-Alone Mode
          2. 8.4.1.1.2 Read-Back Mode
        2. 8.4.1.2 Daisy-Chain Mode
          1. 8.4.1.2.1 SYNC Interrupt - Daisy-Chain Mode
      2. 8.4.2 SPI Shift Register
      3. 8.4.3 DAC Power-Down Modes
      4. 8.4.4 CLR Pin Functionality and Software CLEAR Mode
        1. 8.4.4.1 DAC Clear Mode Registers
      5. 8.4.5 LDAC Pin Functionality
        1. 8.4.5.1 Software LDAC Mode Registers
      6. 8.4.6 Software Reset Mode
      7. 8.4.7 Output Short Circuit Limit Register
      8. 8.4.8 Status Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application - Digitally Controlled Asymmetric Bipolar Output
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 9. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
DAC60004 Click here Click here Click here Click here Click here
DAC70004 Click here Click here Click here Click here Click here
DAC80004 Click here Click here Click here Click here Click here

12.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 Trademarks

E2E is a trademark of Texas Instruments.

SPI, QSPI are trademarks of Motorola.

All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.