SBAS721A December   2015  – January 2016 DAC60096

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: DAC DC
    6. 6.6  Electrical Characteristics: Square-Wave Output
    7. 6.7  Electrical Characteristics: General
    8. 6.8  Timing Requirements
    9. 6.9  Typical Characteristics: DC Mode
    10. 6.10 Typical Characteristics: Toggle Mode
    11. 6.11 Typical Characteristics, General
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital-to-Analog Converters (DACs)
        1. 7.3.1.1 DAC Transfer Function
        2. 7.3.1.2 DAC Register Structure
      2. 7.3.2 Reference Specifications
    4. 7.4 Device Functional Modes
      1. 7.4.1 Toggle Mode
      2. 7.4.2 DC Mode
    5. 7.5 Programming
      1. 7.5.1 Frame Error Checking
    6. 7.6 Register Maps
      1. 7.6.1 8.5.1 BUFA Register (address = 0x0) [reset = 0x0000]
      2. 7.6.2 BUFB Register (address = 0x1) [reset = 0x0000]
      3. 7.6.3 CON Register (address = 0x4) [reset = 0x0555]
      4. 7.6.4 CRC Register (address = 0x5) [reset = 0xFFF]
      5. 7.6.5 PTR Register (address = 0x6) [reset = 0x0000]
      6. 7.6.6 SWR Register (address = 0x7) [reset = 0x0000]
      7. 7.6.7 PWRM Register (address = 0x6) [reset = 0xCAFE]
      8. 7.6.8 SDIV Register (address = 0x9) [reset = 0x0000]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Power-Supply Bypassing
        2. 8.2.2.2 Reference Input
        3. 8.2.2.3 TRIGG/Signal Conditioning
        4. 8.2.2.4 External Amplifier Selection
        5. 8.2.2.5 Unbuffered Settling Response
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Device Reset Options
      1. 9.1.1 Power-on-Reset (POR)
      2. 9.1.2 Hardware Reset
      3. 9.1.3 Software Reset
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
      1. 10.2.1 Optimal Layout Example
      2. 10.2.2 Standard Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

LM231 datasheet, SNOSBI2

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 Trademarks

E2E is a trademark of Texas Instruments.

SPI is a trademark of Motorola Inc.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.