SBAS794E november   2018  – august 2023 DAC60501 , DAC70501 , DAC80501

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements: SPI Mode
    7. 7.7  Timing Requirements: I2C Standard Mode
    8. 7.8  Timing Requirements: I2C Fast Mode
    9. 7.9  Timing Requirements: I2C Fast-Mode Plus
    10. 7.10 Timing Diagrams
    11. 7.11 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 DAC Architecture
        1. 8.3.1.1 DAC Transfer Function
        2. 8.3.1.2 DAC Register Structure
        3. 8.3.1.3 Output Amplifier
      2. 8.3.2 Internal Reference
        1. 8.3.2.1 Solder Heat Reflow
      3. 8.3.3 Power-On-Reset (POR)
      4. 8.3.4 Software Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Mode
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 SPI Mode
          1. 8.5.1.1.1 SYNC Interrupt
        2. 8.5.1.2 I2C Mode
          1. 8.5.1.2.1 F/S Mode Protocol
          2. 8.5.1.2.2 I2C Update Sequence
            1. 8.5.1.2.2.1 Address Byte
            2. 8.5.1.2.2.2 Command Byte
            3. 8.5.1.2.2.3 Data Byte (MSDB and LSDB)
          3. 8.5.1.2.3 I2C Read Sequence
    6. 8.6 Register Map
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Charge Injection
        2. 9.2.2.2 Voltage Droop
        3. 9.2.2.3 Output Offset Error
        4. 9.2.2.4 Switch Selection
        5. 9.2.2.5 Amplifier Selection
        6. 9.2.2.6 Hold Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1)DACx0501UNIT
DGS (VSSOP)DQF (WSON)
10 PINS8 PINS
RθJAJunction-to-ambient thermal resistance170.1122.6°C/W
RθJC(top)Junction-to-case (top) thermal resistance60.558.3°C/W
RθJBJunction-to-board thermal resistance92.650°C/W
ΨJTJunction-to-top characterization parameter7.81.5°C/W
ΨJBJunction-to-board characterization parameter90.749.8°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.