SLASEH3A
October 2020 – May 2021
DAC61402
,
DAC81402
PRODUCTION DATA
1
Features
2
Applications
3
Description
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Timing Requirements: Write, IOVDD: 1.7 V to 2.7 V
7.7
Timing Requirements: Write, IOVDD: 2.7 V to 5.5 V
7.8
Timing Requirements: Read and Daisy Chain, FSDO = 0, IOVDD: 1.7 V to 2.7 V
7.9
Timing Requirements: Read and Daisy Chain, FSDO = 1, IOVDD: 1.7 V to 2.7 V
7.10
Timing Requirements: Read and Daisy Chain, FSDO = 0, IOVDD: 2.7 V to 5.5 V
7.11
Timing Requirements: Read and Daisy Chain, FSDO = 1, IOVDD: 2.7 V to 5.5 V
7.12
Timing Diagrams
7.13
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
R-2R Ladder DAC
8.3.2
Programmable-Gain Output Buffer
8.3.2.1
Sense Pins
8.3.3
DAC Register Structure
8.3.3.1
DAC Output Update
8.3.3.1.1
Synchronous Update
8.3.3.1.2
Asynchronous Update
8.3.3.2
Broadcast DAC Register
8.3.3.3
Clear DAC Operation
8.3.4
Internal Reference
8.3.5
Power-On Reset (POR)
8.3.5.1
Hardware Reset
8.3.5.2
Software Reset
8.3.6
Thermal Alarm
8.4
Device Functional Modes
8.4.1
Power-Down Mode
8.5
Programming
8.5.1
Stand-Alone Operation
8.5.2
Daisy-Chain Operation
8.5.3
Frame Error Checking
8.6
Register Map
8.6.1
NOP Register (address = 00h) [reset = 0000h]
8.6.2
DEVICEID Register (address = 01h) [reset = 0A70h or 0930h]
8.6.3
STATUS Register (address = 02h) [reset = 0000h]
8.6.4
SPICONFIG Register (address = 03h) [reset = 0AA4h]
8.6.5
GENCONFIG Register (address = 04h) [reset = 4000h]
8.6.6
BRDCONFIG Register (address = 05h) [reset = 000Fh]
8.6.7
SYNCCONFIG Register (address = 06h) [reset = 0000h]
8.6.8
DACPWDWN Register (address = 09h) [reset = FFFFh]
8.6.9
DACRANGE Register (address = 0Ah) [reset = 0000h]
8.6.10
TRIGGER Register (address = 0Eh) [reset = 0000h]
8.6.11
BRDCAST Register (address = 0Fh) [reset = 0000h]
8.6.12
DACn Register (address = 11h to 12h) [reset = 0000h]
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
Receiving Notification of Documentation Updates
12.3
Support Resources
12.4
Trademarks
12.5
Electrostatic Discharge Caution
12.6
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RHB|32
MPQF130D
Thermal pad, mechanical data (Package|Pins)
RHB|32
QFND029X
Orderable Information
slaseh3a_oa
slaseh3a_pm
1
Features
Performance:
Specified monotonic at 16-bit resolution
INL: ±1 LSB maximum at 16-bit resolution
TUE: ±0.05% FSR, maximum
Integrated output buffer
Full-scale output voltage: ±5 V, ±10 V, ±20 V, 5 V, 10 V, 20 V, 40 V
High drive capability: ±15 mA
Per channel sense pins
Integrated 2.5-V precision reference
Initial accuracy: ±2.5 mV, maximum
Low drift: 10 ppm/°C, maximum
Reliability features:
CRC error check
Short-circuit limit
Fault pin
50-MHz, SPI-compatible serial interface
4-wire mode, 1.7-V to 5.5-V operation
Readback and daisy-chain operations
Temperature range: –40°C to +125°C
Package: 5-mm × 5-mm, 32-pin QFN