SLASF73 April   2023 DAC63202W

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Voltage Output
    6. 6.6  Electrical Characteristics: Current Output
    7. 6.7  Electrical Characteristics: Comparator Mode
    8. 6.8  Electrical Characteristics: General
    9. 6.9  Timing Requirements: I2C Standard Mode
    10. 6.10 Timing Requirements: I2C Fast Mode
    11. 6.11 Timing Requirements: I2C Fast Mode Plus
    12. 6.12 Timing Requirements: SPI Write Operation
    13. 6.13 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 0)
    14. 6.14 Timing Requirements: SPI Read and Daisy Chain Operation (FSDO = 1)
    15. 6.15 Timing Requirements: GPIO
    16. 6.16 Timing Diagrams
    17. 6.17 Typical Characteristics: Voltage Output
    18. 6.18 Typical Characteristics: Current Output
    19. 6.19 Typical Characteristics: Comparator
    20. 6.20 Typical Characteristics: General
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Smart Digital-to-Analog Converter (DAC) Architecture
      2. 7.3.2 Digital Input/Output
      3. 7.3.3 Nonvolatile Memory (NVM)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Voltage-Output Mode
        1. 7.4.1.1 Voltage Reference and DAC Transfer Function
          1. 7.4.1.1.1 Internal Reference
          2. 7.4.1.1.2 External Reference
          3. 7.4.1.1.3 Power-Supply as Reference
      2. 7.4.2 Current-Output Mode
      3. 7.4.3 Comparator Mode
        1. 7.4.3.1 Programmable Hysteresis Comparator
        2. 7.4.3.2 Programmable Window Comparator
      4. 7.4.4 Fault-Dump Mode
      5. 7.4.5 Application-Specific Modes
        1. 7.4.5.1 Voltage Margining and Scaling
          1. 7.4.5.1.1 High-Impedance Output and PROTECT Input
          2. 7.4.5.1.2 Programmable Slew-Rate Control
          3. 7.4.5.1.3 PMBus Compatibility Mode
        2. 7.4.5.2 Function Generation
          1. 7.4.5.2.1 Triangular Waveform Generation
          2. 7.4.5.2.2 Sawtooth Waveform Generation
          3. 7.4.5.2.3 Sine Waveform Generation
      6. 7.4.6 Device Reset and Fault Management
        1. 7.4.6.1 Power-On Reset (POR)
        2. 7.4.6.2 External Reset
        3. 7.4.6.3 Register-Map Lock
        4. 7.4.6.4 NVM Cyclic Redundancy Check (CRC)
          1. 7.4.6.4.1 NVM-CRC-FAIL-USER Bit
          2. 7.4.6.4.2 NVM-CRC-FAIL-INT Bit
      7. 7.4.7 Power-Down Mode
    5. 7.5 Programming
      1. 7.5.1 SPI Programming Mode
      2. 7.5.2 I2C Programming Mode
        1. 7.5.2.1 F/S Mode Protocol
        2. 7.5.2.2 I2C Update Sequence
          1. 7.5.2.2.1 Address Byte
          2. 7.5.2.2.2 Command Byte
        3. 7.5.2.3 I2C Read Sequence
      3. 7.5.3 General-Purpose Input/Output (GPIO) Modes
    6. 7.6 Register Map
      1. 7.6.1  NOP Register (address = 00h) [reset = 0000h]
      2. 7.6.2  DAC-X-MARGIN-HIGH Register (address = 13h, 01h) [reset = 0000h]
      3. 7.6.3  DAC-X-MARGIN-LOW Register (address = 14h, 02h) [reset = 0000h]
      4. 7.6.4  DAC-X-VOUT-CMP-CONFIG Register (address = 15h, 03h) [reset = 0000h]
      5. 7.6.5  DAC-X-IOUT-MISC-CONFIG Register (address = 16h, 04h) [reset = 0000h]
      6. 7.6.6  DAC-X-CMP-MODE-CONFIG Register (address = 17h, 05h) [reset = 0000h]
      7. 7.6.7  DAC-X-FUNC-CONFIG Register (address = 18h, 06h) [reset = 0000h]
      8. 7.6.8  DAC-X-DATA Register (address = 1Ch, 19h) [reset = 0000h]
      9. 7.6.9  COMMON-CONFIG Register (address = 1Fh) [reset = 0FFFh]
      10. 7.6.10 COMMON-TRIGGER Register (address = 20h) [reset = 0000h]
      11. 7.6.11 COMMON-DAC-TRIG Register (address = 21h) [reset = 0000h]
      12. 7.6.12 GENERAL-STATUS Register (address = 22h) [reset = 00h, DEVICE-ID, VERSION-ID]
      13. 7.6.13 CMP-STATUS Register (address = 23h) [reset = 0000h]
      14. 7.6.14 GPIO-CONFIG Register (address = 24h) [reset = 0000h]
      15. 7.6.15 DEVICE-MODE-CONFIG Register (address = 25h) [reset = 0000h]
      16. 7.6.16 INTERFACE-CONFIG Register (address = 26h) [reset = 0000h]
      17. 7.6.17 SRAM-CONFIG Register (address = 2Bh) [reset = 0000h]
      18. 7.6.18 SRAM-DATA Register (address = 2Ch) [reset = 0000h]
      19. 7.6.19 BRDCAST-DATA Register (address = 50h) [reset = 0000h]
      20. 7.6.20 PMBUS-PAGE Register [reset = 0300h]
      21. 7.6.21 PMBUS-OP-CMD-X Register [reset = 0000h]
      22. 7.6.22 PMBUS-CML Register [reset = 0000h]
      23. 7.6.23 PMBUS-VERSION Register [reset = 2200h]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YBH|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5.2.2 I2C Update Sequence

Table 7-14 shows that for a single update, the DAC63202W require a start condition, a valid I2C address byte, a command byte, and two data bytes.
Table 7-14 Update Sequence
MSB .... LSB ACK MSB ... LSB ACK MSB ... LSB ACK MSB ... LSB ACK
Address (A) byte
Section 7.5.2.2.1		 Command byte
Section 7.5.2.2.2		 Data byte - MSDB Data byte - LSDB
DB [31:24] DB [23:16] DB [15:8] DB [7:0]

Figure 7-23 shows that after each byte is received, the DAC63202W family acknowledges the byte by pulling the SDA line low during the high period of a single clock pulse. These four bytes and acknowledge cycles make up the 36 clock cycles required for a single update to occur. A valid I2C address byte selects the DAC63202W.

GUID-5AEC3255-AF62-4B60-8FB7-6C8399C68AF1-low.svg Figure 7-23 I2C Bus Protocol

The command byte sets the operating mode of the selected DAC63202W device. For a data update to occur when the operating mode is selected by this byte, the DAC63202W device must receive two data bytes: the most significant data byte (MSDB) and least significant data byte (LSDB). The DAC63202W device performs an update on the falling edge of the acknowledge signal that follows the LSDB.

When using fast mode (clock = 400 kHz), the maximum DAC update rate is limited to 10 kSPS. Using fast mode plus (clock = 1 MHz), the maximum DAC update rate is limited to 25 kSPS. When a stop condition is received, the DAC63202W device releases the I2C bus and awaits a new start condition.