SLASED6D April   2016  – December 2017 DAC60004 , DAC70004 , DAC80004

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 DACx0004 Timing Requirements
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Output Amplifier
      2. 8.3.2 Reference Buffer
      3. 8.3.3 Power-On Reset
        1. 8.3.3.1 POR Pin Feature
        2. 8.3.3.2 Internal Power-On Reset (IPOR) Levels
    4. 8.4 Device Functional Modes
      1. 8.4.1 Serial Interface
        1. 8.4.1.1 Stand-Alone Mode
          1. 8.4.1.1.1 SYNC Interrupt - Stand-Alone Mode
          2. 8.4.1.1.2 Read-Back Mode
        2. 8.4.1.2 Daisy-Chain Mode
          1. 8.4.1.2.1 SYNC Interrupt - Daisy-Chain Mode
      2. 8.4.2 SPI Shift Register
      3. 8.4.3 DAC Power-Down Modes
      4. 8.4.4 CLR Pin Functionality and Software CLEAR Mode
        1. 8.4.4.1 DAC Clear Mode Registers
      5. 8.4.5 LDAC Pin Functionality
        1. 8.4.5.1 Software LDAC Mode Registers
      6. 8.4.6 Software Reset Mode
      7. 8.4.7 Output Short Circuit Limit Register
      8. 8.4.8 Status Register
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application - Digitally Controlled Asymmetric Bipolar Output
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from C Revision (August 2016) to D Revision

  • Changed 2.4 µs From MAX to MIN value for t20 in the DACx0004 Timing Requirements tableGo
  • Changed From: t19 To: t20 in Figure 1 Go

Changes from B Revision (June 2016) to C Revision

  • Deleted thermal pad from PW-TSSOP pin configurationGo

Changes from A Revision (June 2016) to B Revision

Changes from * Revision (April 2016) to A Revision

  • Changed from Product Preview to Production Data Go