SBAS793A November   2019  – April 2020 DAC60502 , DAC70502 , DAC80502

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Functional Block Diagram
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements : SPI Mode
    7. 7.7  Timing Requirements : I2C Standard Mode
    8. 7.8  Timing Requirements : I2C Fast Mode
    9. 7.9  Timing Requirements : I2C Fast-Mode Plus
    10. 7.10 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Digital-to-Analog Converter (DAC) Architecture
        1. 8.3.1.1 DAC Transfer Function
        2. 8.3.1.2 DAC Register Structure
        3. 8.3.1.3 Output Amplifier
      2. 8.3.2 Internal Reference
        1. 8.3.2.1 Solder Heat Reflow
      3. 8.3.3 Power-On Reset (POR)
      4. 8.3.4 Software Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Mode
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 SPI Mode
          1. 8.5.1.1.1 SYNC Interrupt
        2. 8.5.1.2 I2C Mode
          1. 8.5.1.2.1 F/S Mode Protocol
          2. 8.5.1.2.2 DACx0502 I2C Update Sequence
            1. 8.5.1.2.2.1 DACx0502 Address Byte
            2. 8.5.1.2.2.2 DACx0502 Command Byte
            3. 8.5.1.2.2.3 DACx0502 Data Byte (MSDB and LSDB)
          3. 8.5.1.2.3 DACx0502 I2C Read Sequence
    6. 8.6 Register Maps
      1. 8.6.1 Registers
        1. 8.6.1.1 NOOP Register (offset = 0h) [reset = 0000h]
          1. Table 9. NOOP Register Field Descriptions
        2. 8.6.1.2 DEVID Register (offset = 1h) [reset = 0214h for DAC80502, 1214h for DAC70502, 2214h for DAC60502]
          1. Table 10. DEVID Register Field Descriptions
        3. 8.6.1.3 SYNC Register (offset = 2h) [reset = 0300h]
          1. Table 11. SYNC Register Field Descriptions
        4. 8.6.1.4 CONFIG Register (offset = 3h) [reset = 0000h]
          1. Table 12. CONFIG Register Field Descriptions
        5. 8.6.1.5 GAIN Register (offset = 4h) [reset = 0003h]
          1. Table 13. GAIN Register Field Descriptions
        6. 8.6.1.6 TRIGGER Register (offset = 5h) [reset = 0000h]
          1. Table 14. TRIGGER Register Field Descriptions
        7. 8.6.1.7 BRDCAST Register (offset = 6h) [reset = 0000h for RSTSEL = 0, or reset = 8000h for RSTSEL = 1]
          1. Table 15. BRDCAST Register Field Descriptions
        8. 8.6.1.8 STATUS Register (offset = 7h) [reset = 0000h]
          1. Table 16. STATUS Register Field Descriptions
        9. 8.6.1.9 DAC-n Register (offset = 8h–9h) [reset = 0000h for RSTSEL = 0, or reset = 8000h for RSTSEL = 1]
          1. Table 17. DAC-A Data Register Field Descriptions (8h)
          2. Table 18. DAC-B Data Register Field Descriptions (9h)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 SPI Connection to a Processor
      2. 9.3.2 I2C Interface Connection to a Processor
    4. 9.4 What To Do and What Not To Do
      1. 9.4.1 What To Do
      2. 9.4.2 What Not To Do
    5. 9.5 Initialization Setup
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.2 Detailed Design Procedure

Figure 72 shows a simplified circuit diagram of a battery test system. Use the internal reference (2.5 V) and gain of 1 for an output range of 2.5 V. The reference divider is 1. Select the 16-bit DAC80502 for the best accuracy. The typical value of the TUE is 0.02%FSR, as specified in the Typical Characteristics table. The absolute error at the DAC output includes the error from the reference, the error from the DAC, and the temperatures drifts of offset error, gain error, and reference. Ignore the load regulation, line regulation, and long-term drift of the reference as compared to the initial accuracy and temperature drift. Write the total TUE at the DAC output, as given in Equation 2.

Equation 2. DAC80502 DAC70502 DAC60502 dac80502-total-tue-eq.gif

where

  • TCOE is the temperature drift of the offset error.
  • TCGE is the temperature drift of the gain error.
  • EREF is the initial accuracy of the reference.
  • TCREF is the temperature drift of the reference.
  • GAIN is the gain setting of the DAC in combination with the reference divider.

Convert the INL value in LSB to %FSR using Equation 3.

Equation 3. DAC80502 DAC70502 DAC60502 dac80502-lsb-to-fsr-eq.gif

Convert the temperature drift values in ppm/°C to %FSR using Equation 4.

Equation 4. DAC80502 DAC70502 DAC60502 dac80502-ppm-to-fsr-eq.gif

where

  • ∆T is the temperature range.

Calculate the total error after the offset and gain of DAC are calibrated using Equation 5

Equation 5. DAC80502 DAC70502 DAC60502 dac80502-total-error-after-cal-eq.gif

The total error at the DAC output calculated using the previous equations is 0.112%FSR before calibration, and 0.05%FSR after calibration. For better accuracy, perform a temperature calibration. Figure 73 and Figure 74 show the drift in the internal reference voltage and TUE, respectively over 0°C to 100°C.