SBAS793A November   2019  – April 2020 DAC60502 , DAC70502 , DAC80502

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Functional Block Diagram
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements : SPI Mode
    7. 7.7  Timing Requirements : I2C Standard Mode
    8. 7.8  Timing Requirements : I2C Fast Mode
    9. 7.9  Timing Requirements : I2C Fast-Mode Plus
    10. 7.10 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Digital-to-Analog Converter (DAC) Architecture
        1. 8.3.1.1 DAC Transfer Function
        2. 8.3.1.2 DAC Register Structure
        3. 8.3.1.3 Output Amplifier
      2. 8.3.2 Internal Reference
        1. 8.3.2.1 Solder Heat Reflow
      3. 8.3.3 Power-On Reset (POR)
      4. 8.3.4 Software Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Mode
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 SPI Mode
          1. 8.5.1.1.1 SYNC Interrupt
        2. 8.5.1.2 I2C Mode
          1. 8.5.1.2.1 F/S Mode Protocol
          2. 8.5.1.2.2 DACx0502 I2C Update Sequence
            1. 8.5.1.2.2.1 DACx0502 Address Byte
            2. 8.5.1.2.2.2 DACx0502 Command Byte
            3. 8.5.1.2.2.3 DACx0502 Data Byte (MSDB and LSDB)
          3. 8.5.1.2.3 DACx0502 I2C Read Sequence
    6. 8.6 Register Maps
      1. 8.6.1 Registers
        1. 8.6.1.1 NOOP Register (offset = 0h) [reset = 0000h]
          1. Table 9. NOOP Register Field Descriptions
        2. 8.6.1.2 DEVID Register (offset = 1h) [reset = 0214h for DAC80502, 1214h for DAC70502, 2214h for DAC60502]
          1. Table 10. DEVID Register Field Descriptions
        3. 8.6.1.3 SYNC Register (offset = 2h) [reset = 0300h]
          1. Table 11. SYNC Register Field Descriptions
        4. 8.6.1.4 CONFIG Register (offset = 3h) [reset = 0000h]
          1. Table 12. CONFIG Register Field Descriptions
        5. 8.6.1.5 GAIN Register (offset = 4h) [reset = 0003h]
          1. Table 13. GAIN Register Field Descriptions
        6. 8.6.1.6 TRIGGER Register (offset = 5h) [reset = 0000h]
          1. Table 14. TRIGGER Register Field Descriptions
        7. 8.6.1.7 BRDCAST Register (offset = 6h) [reset = 0000h for RSTSEL = 0, or reset = 8000h for RSTSEL = 1]
          1. Table 15. BRDCAST Register Field Descriptions
        8. 8.6.1.8 STATUS Register (offset = 7h) [reset = 0000h]
          1. Table 16. STATUS Register Field Descriptions
        9. 8.6.1.9 DAC-n Register (offset = 8h–9h) [reset = 0000h for RSTSEL = 0, or reset = 8000h for RSTSEL = 1]
          1. Table 17. DAC-A Data Register Field Descriptions (8h)
          2. Table 18. DAC-B Data Register Field Descriptions (9h)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 SPI Connection to a Processor
      2. 9.3.2 I2C Interface Connection to a Processor
    4. 9.4 What To Do and What Not To Do
      1. 9.4.1 What To Do
      2. 9.4.2 What Not To Do
    5. 9.5 Initialization Setup
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

DRX Package
10-Pin WSON
Top View

Pin Functions

PIN TYPE DESCRIPTION
NAME NO.
AGND 4 Ground Ground reference point for all circuitry on the device
RSTSEL 3 Input Reset select pin.
DACs power up to zero scale if RSTSEL = AGND.
DACs power up to midscale if RSTSEL = VDD
SCLK/SCL 6 Input Serial interface clock. SPI or I2C mode.
SDIN/SDA 8 Input/Output SPI mode: Serial interface data input. Data are clocked into the input shift register on each falling edge of the SCLK pin.
I2C mode: Data are clocked into or out of the input register. This pin is a bidirectional, SDA drain data line that must be connected to the supply voltage with an external pull-up resistor.
SPI2C 5 Input Interface select pin. The SPI2C pin must be kept static after device powers up.
If SPI2C = 0, the digital interface is in SPI mode
If SPI2C = 1, the digital interface is in I2C mode
SYNC/A0 7 Input SPI mode: Active low serial data enable. This input is the frame-synchronization signal for the serial data. When the signal goes low, the serial interface input shift register is enabled.
I2C mode: Four-state address input.
VDD 1 Power Analog supply voltage (2.7 V to 5.5 V)
VOUTA 2 Output Analog output voltage from DAC A
VOUTB 9 Output Analog output voltage from DAC B
VREFIO 10 Input/Output When using the internal reference, this pin is the reference output voltage pin (default).
When operating with an external reference, this pin is the reference input to the device.