SLASER3A July   2018  – November 2018 DAC61408 , DAC71408 , DAC81408

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Functional Block Diagram
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Digital-to-Analog Converters (DACs) Architecture
        1. 9.3.1.1 DAC Transfer Function
        2. 9.3.1.2 DAC Register Structure
          1. 9.3.1.2.1 DAC Register Synchronous and Asynchronous Updates
          2. 9.3.1.2.2 Broadcast DAC Register
          3. 9.3.1.2.3 Clear DAC Operation
      2. 9.3.2 Internal Reference
      3. 9.3.3 Device Reset Options
        1. 9.3.3.1 Power-on-Reset (POR)
        2. 9.3.3.2 Hardware Reset
        3. 9.3.3.3 Software Reset
      4. 9.3.4 Thermal Protection
        1. 9.3.4.1 Analog Temperature Sensor: TEMPOUT Pin
        2. 9.3.4.2 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Toggle Mode
      2. 9.4.2 Differential Mode
      3. 9.4.3 Power-Down Mode
    5. 9.5 Programming
      1. 9.5.1 Stand-Alone Operation
        1. 9.5.1.1 Streaming Mode Operation
      2. 9.5.2 Daisy-Chain Operation
      3. 9.5.3 Frame Error Checking
    6. 9.6 Register Maps
      1. 9.6.1  NOP Register (Offset = 00h) [reset = 0000h]
        1. Table 9. NOP Register Field Descriptions
      2. 9.6.2  DEVICEID Register (Offset = 01h) [reset = ----h]
        1. Table 10. DEVICEID Register Field Descriptions
      3. 9.6.3  STATUS Register (Offset = 02h) [reset = 0000h]
        1. Table 11. STATUS Register Field Descriptions
      4. 9.6.4  SPICONFIG Register (Offset = 03h) [reset = 0A24h]
        1. Table 12. SPICONFIG Register Field Descriptions
      5. 9.6.5  GENCONFIG Register (Offset = 04h) [reset = 7F00h]
        1. Table 13. GENCONFIG Register Field Descriptions
      6. 9.6.6  BRDCONFIG Register (Offset = 05h) [reset = FFFFh]
        1. Table 14. BRDCONFIG Register Field Descriptions
      7. 9.6.7  SYNCCONFIG Register (Offset = 06h) [reset = 0000h]
        1. Table 15. SYNCCONFIG Register Field Descriptions
      8. 9.6.8  TOGGCONFIG0 Register (Offset = 07h) [reset = 0000h]
        1. Table 16. TOGGCONFIG0 Register Field Descriptions
      9. 9.6.9  TOGGCONFIG1 Register (Offset = 08h) [reset = 0000h]
        1. Table 17. TOGGCONFIG1 Register Field Descriptions
      10. 9.6.10 DACPWDWN Register (Offset = 09h) [reset = FFFFh]
        1. Table 18. DACPWDWN Register Field Descriptions
      11. 9.6.11 DACRANGEn Register (Offset = 0Bh - 0Ch) [reset = 0000h]
        1. Table 19. DACRANGEn Register Field Descriptions
      12. 9.6.12 TRIGGER Register (Offset = 0Eh) [reset = 0000h]
        1. Table 20. TRIGGER Register Field Descriptions
      13. 9.6.13 BRDCAST Register (Offset = 0Fh) [reset = 0000h]
        1. Table 21. BRDCAST Register Field Descriptions
      14. 9.6.14 DACn Register (Offset = 14h - 1Bh) [reset = 0000h]
        1. Table 22. DACn Register Field Descriptions
      15. 9.6.15 OFFSETn Register (Offset = 21h - 22h) [reset = 0000h]
        1. Table 23. OFFSETn Register Field Descriptions
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure for Remote Ground Tracking
        1. 10.2.2.1 Generating 300mV Offset
        2. 10.2.2.2 Amplifier Selection
        3. 10.2.2.3 Passive Component Selection
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHA|40
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.2.2.1 Generating 300mV Offset

There is no off-the-shelf solution for generating a 300-mV offset, unfortunately. Figure 67 depicts a method to generate it using discrete components. It uses LM4041 adjustable shunt regulator on high-side from the 2.5-V reference. It has a reference input pin that sets the voltage across this device. Given that VRef is 1.233 V, choosing R1 = 16 kΩ and R2 = 12 kΩ the voltage Vo can be calculated by superposition as 2.16 V. This will provide an offset of (2.5 V – 2.16 V) = 340 mV that will provide a safe margin from DAC ground.