SLAS767B June   2011  – March 2015 DAC7551-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital-to-Analog Converter
      2. 7.3.2 Resistor String
      3. 7.3.3 Output Buffer Amplifiers
        1. 7.3.3.1 DAC External Reference Input
        2. 7.3.3.2 Amplifier Sense Input
        3. 7.3.3.3 Power-On Reset
        4. 7.3.3.4 Power Down
        5. 7.3.3.5 Asynchronous Clear
        6. 7.3.3.6 IOVDD and Level Shifters
      4. 7.3.4 Integral and Differential Linearity
      5. 7.3.5 Glitch Energy
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 16-Bit Word and Input Shift Register
        2. 7.5.1.2 Daisy-Chain Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Waveform Generation
      2. 8.1.2 Generating ±5-V, ±10-V, and ±12-V Outputs For Precision Industrial Control
        1. 8.1.2.1 Loop Accuracy
        2. 8.1.2.2 Loop Speed
    2. 8.2 Typical Application
      1. 8.2.1 Generating Industrial Voltage Ranges
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation, see the following:

  • OPA4130 Low Power, Precision FET-INPUT OPERATIONAL AMPLIFIERS, SBOS053
  • REF02 +5V Precision VOLTAGE REFERENCE, SBVS003
  • REF3140 15ppm/°C Max, 100μA, SOT23-3 SERIES VOLTAGE REFERENCE, SBVS046

11.2 Trademarks

SPI, QSPI are trademarks of Motorola, Inc.

All other trademarks are the property of their respective owners.

11.3 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.