SLAS767B June   2011  – March 2015 DAC7551-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital-to-Analog Converter
      2. 7.3.2 Resistor String
      3. 7.3.3 Output Buffer Amplifiers
        1. 7.3.3.1 DAC External Reference Input
        2. 7.3.3.2 Amplifier Sense Input
        3. 7.3.3.3 Power-On Reset
        4. 7.3.3.4 Power Down
        5. 7.3.3.5 Asynchronous Clear
        6. 7.3.3.6 IOVDD and Level Shifters
      4. 7.3.4 Integral and Differential Linearity
      5. 7.3.5 Glitch Energy
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 16-Bit Word and Input Shift Register
        2. 7.5.1.2 Daisy-Chain Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Waveform Generation
      2. 8.1.2 Generating ±5-V, ±10-V, and ±12-V Outputs For Precision Industrial Control
        1. 8.1.2.1 Loop Accuracy
        2. 8.1.2.2 Loop Speed
    2. 8.2 Typical Application
      1. 8.2.1 Generating Industrial Voltage Ranges
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.