SLASF62 June   2024 DAC80516

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements - I2C Standard Mode
    7. 5.7  Timing Requirements - I2C Fast Mode
    8. 5.8  Timing Requirements - I2C Fast Mode Plus
    9. 5.9  Timing Requirements - SPI
    10. 5.10 Switching Characteristics
    11. 5.11 Timing Diagrams
    12. 5.12 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Digital-to-Analog Converter (DAC) Architecture
        1. 6.3.1.1 DAC Register Structure
          1. 6.3.1.1.1 DAC Synchronous Operation
          2. 6.3.1.1.2 DAC Buffer Amplifier
          3. 6.3.1.1.3 DAC Transfer Function
      2. 6.3.2 Internal Reference
      3. 6.3.3 Power-On Reset (POR)
    4. 6.4 Device Functional Modes
      1. 6.4.1 Clear Mode
    5. 6.5 Programming
      1. 6.5.1 I2C Serial Interface
        1. 6.5.1.1 I2C Bus Overview
        2. 6.5.1.2 I2C Bus Definitions
        3. 6.5.1.3 I2C Target Address Selection
        4. 6.5.1.4 I2C Read and Write Operations
        5. 6.5.1.5 I2C General-Call Reset
      2. 6.5.2 Serial Peripheral Interface (SPI)
        1. 6.5.2.1 SPI Bus Overview
  8. 7 Register Map
    1. 7.1 DAC80516 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Bipolar Voltage Output
    2. 8.2 Typical Application
      1. 8.2.1 Programmable High-Current Voltage Output Circuit
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 Initialization Setup
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RUY|28
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5.1.3 I2C Target Address Selection

The I2C bus target address is selected by installing shunts from the A0 and A1 pins to the VIO or GND rails. The state of the A0 and A1 pins is tested after every occurrence of START condition on the I2C bus. The device discerns between two possible options for each pin, shunt to VIO (logic 1) and shunt to GND (logic 0), for a total of four possible target addresses, as shown in Table 6-3.

Table 6-3 I2C Target Address Space
DEVICE PINS I2C TARGET ADDRESS
A1 A0 [A6:A0]
0 0 101 0000
0 1 101 0001
1 0 101 0100
1 1 101 0101